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NTHD2102PT1G

Onsemi

NTHD2102PT1G by Onsemi

NTHD2102PT1G by Onsemi is a P-CHANNEL FET with 8V DS Breakdown Voltage, 3.4A ID, and 0.058 ohm RDS(on). Ideal for SWITCHING applications, it features 2 elements with built-in diode in a small outline package for enhanced performance.

Median Price

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Lifecycle Status

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9

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Sea View Technologies

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Bristol Electronics

USA . 72,000 parts In-Stock

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Vyrian

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J2 Sourcing AB

Sweden . 6,117 parts In-Stock

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Rebound Electronics

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Digiode

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LIBRA Elektronik GmbH

Germany . 2,074 parts In-Stock

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Elcom Components

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Prism Electronics

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AZTECH Wire

Italy . 969 parts In-Stock

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RC Electronics

USA . 114,339 parts In-Stock

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Kepictronics

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Assy Fe

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Kulean Microsystems

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SupplyDigital Components

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Corphita

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TANS Electronics

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Problanco Electronics

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Overview

Unleash the power of innovation with the NTHD2102PT1G by Onsemi. Crafted with precision and quality, this P-CHANNEL Power Field Effect Transistor offers unmatched performance for switching applications. With a sleek surface mount design and built-in diode, this transistor provides seamless operation and reliability. Elevate your projects with the maximum pulsing drain current of 4.6 A and maximum power dissipation of 2.1 W. Embrace efficiency and excellence with the NTHD2102PT1G - where cutting-edge technology meets unparalleled value.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-Channel FETs are known for their low on-state resistance and high current carrying capability, making them suitable for high-power applications.

Minimum DS Breakdown Voltage: 8 V

The high breakdown voltage ensures the FET can withstand high voltages without breakdown, making it suitable for various applications where voltage spikes may occur.

Maximum Drain Current (Abs): 3.4 A

The high maximum drain current rating allows the FET to handle high currents without overheating or failing, making it ideal for applications requiring high power handling capabilities.

Maximum Power Dissipation (Abs): 2.1 W

The high power dissipation rating indicates that the FET can handle significant heat dissipation, leading to improved reliability and longevity in high-power applications.

Maximum Drain-Source On Resistance: 0.058 ohm

The low on-resistance of the FET results in minimal power loss and high efficiency when conducting current, making it an excellent choice for applications where power efficiency is crucial.

Technical Specifications

Power Field Effect Transistors (FET) NTHD2102PT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (Abs) (ID):

3.4 A

Maximum Drain Current (ID):

3.4 A

Maximum Drain-Source On Resistance:

.058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

4.6 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD2102PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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