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NTHD4P02FT1G

Onsemi

NTHD4P02FT1G by Onsemi

NTHD4P02FT1G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 2.2A Drain Current. Ideal for SWITCHING applications, it features a 37ns Turn On Time, -55 to 150°C Operating Temperature range, and a compact SMALL OUTLINE package style.

Median Price

$0.800

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,720 parts In-Stock

1+ parts

$2.200

100+ parts

$0.958

1k+ parts

$0.702

10k+ parts

-

1,720

$2.200

$0.958

$0.702

-

Rochester

USA . 626,615 parts In-Stock

1+ parts

-

100+ parts

$0.854

1k+ parts

$0.708

10k+ parts

$0.632

626,615

-

$0.854

$0.708

$0.632

Farnell

UK . 569,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$0.800

569,257

-

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$0.800

Flip Electronics (Authorized)

USA . 257,443 parts In-Stock

1+ parts

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257,443

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Verical

USA . 105,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.885

10k+ parts

$0.789

105,000

-

-

$0.885

$0.789

Arrow

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.580

9,000

-

-

-

$0.580

Chip1Stop

Japan . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.247

9,000

-

-

-

$0.247

Mouser Electronics

USA . 2,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.629

2,892

-

-

-

$0.629

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 770 parts In-Stock

1+ parts

$0.247

100+ parts

-

1k+ parts

-

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770

$0.247

-

-

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Digiode

USA . 485 parts In-Stock

1+ parts

$0.665

100+ parts

-

1k+ parts

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485

$0.665

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Flip Electronics

USA . 257,443 parts In-Stock

1+ parts

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257,443

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Rebound Electronics

UK . 21,000 parts In-Stock

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21,000

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Cyclops Electronics Ltd

UK . 9,057 parts In-Stock

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9,057

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ACDS - Activité Composants Distribution Service

France . 1,540 parts In-Stock

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1,540

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 107 parts In-Stock

1+ parts

$0.247

100+ parts

-

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107

$0.247

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Corphita

USA . 2,437 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

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2,437

$0.630

-

-

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.805

100+ parts

$0.733

1k+ parts

$0.660

10k+ parts

-

60

$0.805

$0.733

$0.660

-

Continental Prestige Electronics

USA . 568,651 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.632

10k+ parts

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568,651

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-

$0.632

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Kepictronics

USA . 54,000 parts In-Stock

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54,000

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Lixinc

USA . 17,878 parts In-Stock

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17,878

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Perfect Parts

USA . 9,503 parts In-Stock

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9,503

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QUARKTWIN TECHNOLOGY LTD

USA . 8,120 parts In-Stock

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8,120

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Kulean Microsystems

USA . 7,861 parts In-Stock

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7,861

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Microchip USA

USA . 5,845 parts In-Stock

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5,845

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Problanco Electronics

Mexico . 5,217 parts In-Stock

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5,217

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A-Z Elektronik GmbH

Germany . 2,897 parts In-Stock

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2,897

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Authorized Procurement Solutions

USA . 2,829 parts In-Stock

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2,829

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GreenTree Electronics

Israel . 2,829 parts In-Stock

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2,829

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SupplyDigital Components

Austria . 2,787 parts In-Stock

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2,787

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TANS Electronics

Latvia . 2,081 parts In-Stock

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2,081

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Cyclops Electronics Ltd (Excess)

UK . 1,540 parts In-Stock

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1,540

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 860 parts In-Stock

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860

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Overview

Unleash the power of innovation with the NTHD4P02FT1G by Onsemi! As a leader in Power Field Effect Transistors, Onsemi delivers top-quality products that guarantee superior performance and reliability. Ideal for switching applications, this P-Channel transistor offers a single configuration with a built-in diode, making it versatile and efficient. With a maximum drain current of 2.2A and a low on-resistance of 0.155 ohm, this transistor maximizes power dissipation while operating at a wide temperature range. Elevate your designs with the NTHD4P02FT1G and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Offers efficient switching and control capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: SWITCHING

Suitable for applications that require fast switching speeds and low power dissipation.

Surface Mount: YES

Facilitates easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 20 V

Provides a high breakdown voltage for reliable operation in various voltage conditions.

Package Shape: RECTANGULAR

Easily fits into standard PCB layouts and layouts for efficient integration.

Terminal Form: FLAT

Ensures secure connections and minimizes the risk of signal interference.

Operating Mode: ENHANCEMENT MODE

Offers better control over the transistor's operation and enhances performance.

Maximum Pulsed Drain Current (IDM): 9 A

Allows for handling high current pulses without causing damage to the transistor.

Maximum Drain Current (Abs) (ID): 2.1 A

Sustains a continuous drain current within the specified limit for stable operation.

No. of Terminals: 8

Provides multiple connection options for versatile applications.

Maximum Power Dissipation (Abs): 1.1 W

Ensures efficient power handling without risking thermal damage.

Package Style (Meter): SMALL OUTLINE

Facilitates space-saving on the PCB and allows for compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability in various operating conditions.

Maximum Operating Temperature: 150 °C

Operates effectively even in high-temperature environments, ensuring stability.

Transistor Element Material: SILICON

Provides excellent semiconductor properties for optimal transistor performance.

Maximum Turn On Time (ton): 37 ns

Enables fast switching speeds for quick response times in switching applications.

Minimum Operating Temperature: -55 °C

Functions reliably even in extreme cold environments without compromising performance.

Maximum Turn Off Time (toff): 90 ns

Ensures efficient turn-off times for controlling power dissipation and reducing heat generation.

Terminal Finish: MATTE TIN

Provides a reliable and durable terminal finish for secure connections.

Maximum Drain Current (ID): 2.2 A

Allows for slightly higher drain current ratings for flexibility and margin in operation.

Maximum Drain-Source On Resistance: 0.155 ohm

Offers low on-resistance for efficient power handling and minimal voltage drop.

Terminal Position: DUAL

Provides multiple terminal positions for flexible PCB layout design.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly without damaging the transistor.

Peak Reflow Temperature °C: 260

Allows for high-temperature reflow soldering process without impacting the transistor's performance.

Maximum Feedback Capacitance (Crss): 50 pF

Offers low feedback capacitance for improved high-frequency performance and stability.

Technical Specifications

Power Field Effect Transistors (FET) NTHD4P02FT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.1 A

Maximum Drain Current (ID):

2.2 A

Maximum Drain-Source On Resistance:

.155 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

9 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

90 ns

Maximum Turn On Time (ton):

37 ns

Trade Compliance

NTHD4P02FT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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