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NSVDTC113EM3T5G

Onsemi

NSVDTC113EM3T5G by Onsemi

NSVDTC113EM3T5G by Onsemi is a NPN BJT transistor with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 3. This small outline package with matte tin finish is ideal for surface mount designs in automotive electronics.

Median Price

$0.041

Lifecycle Status

Suppliers In-Stock

7

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1k+

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Flip Electronics (Authorized)

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USA . 360,000 parts In-Stock

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Vyrian

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Component Stockers USA

USA . 223,715 parts In-Stock

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TANS Electronics

Latvia . 5,773 parts In-Stock

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Kulean Microsystems

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Overview

Unlock the power of innovation with the NSVDTC113EM3T5G by Onsemi. This high-quality Small Signal Bipolar Junction Transistor (BJT) is a game-changer in the world of switching applications. With Onsemi's reputation for excellence and cutting-edge technology, you can trust that this NPN transistor will deliver exceptional performance and reliability. Its built-in resistor configuration makes it easy to integrate into your designs, while its compact package shape and surface mount capabilities offer versatility for a wide range of applications. Experience the difference with Onsemi and take your projects to the next level with the NSVDTC113EM3T5G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the transistor suitable for a wide range of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching applications, offering reliable performance and versatility.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space, making the transistor convenient for compact electronic devices.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast switching speeds and efficient performance in various electronic circuits.

Surface Mount: YES

Being surface mountable, this transistor can be easily integrated into PCBs, facilitating automated assembly and saving production time.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a circuit board and ensures uniform spacing for reliable connections.

Terminal Form: FLAT

The flat terminal form provides a stable connection point and minimizes the risk of shorts, ensuring reliable operation of the transistor.

No. of Terminals: 3

With three terminals, this transistor offers versatility in circuit configurations and compatibility with a wide range of applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for high-density mounting, ideal for miniaturized electronic devices.

Minimum DC Current Gain (hFE): 3

The minimum DC current gain of 3 ensures reliable amplification and control of current flow in the circuit, enhancing overall performance.

Maximum Collector-Emitter Voltage: 50 V

With a high maximum voltage rating, this transistor can withstand higher voltages, making it suitable for a variety of high-power applications.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its stability and efficiency, ensuring consistent performance of the transistor.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1 A, this transistor can handle moderate power loads, making it suitable for various electronic circuits.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and ensures good solderability, allowing for reliable connections and long-term performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and facilitates easy connection to external components, enhancing the transistor's usability.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this transistor can withstand high-temperature soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for efficient solder melting and bonding, ensuring secure connections during the assembly process.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality, making this transistor suitable for automotive and industrial applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSVDTC113EM3T5G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTANCE RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

3

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSVDTC113EM3T5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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