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NSBA114YDXV6T1

Onsemi

NSBA114YDXV6T1 by Onsemi

NSBA114YDXV6T1 by Onsemi is a PNP BJT with 2 elements, built-in resistor, hFE of 80. Ideal for switching applications with max IC of 0.1A and VCE of 50V. Features small outline package style, flat terminals, and surface mount capability.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 136,788 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

136,788

-

$0.053

$0.044

$0.039

DigiKey

USA . 136,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

136,788

-

-

-

$0.070

Verical

USA . 132,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.049

132,788

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-

-

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 381 parts In-Stock

1+ parts

$0.041

100+ parts

-

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381

$0.041

-

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Chip Stock

USA . 57,000 parts In-Stock

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57,000

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Vyrian

USA . 8,920 parts In-Stock

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8,920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 731 parts In-Stock

1+ parts

$0.039

100+ parts

-

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731

$0.039

-

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-

Component Stockers USA

USA . 85,949 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

1k+ parts

$0.040

10k+ parts

$0.040

85,949

$0.040

$0.040

$0.040

$0.040

Corohmni

South Africa . 370 parts In-Stock

1+ parts

$0.043

100+ parts

-

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370

$0.043

-

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AZTECH Wire

Italy . 992 parts In-Stock

1+ parts

$8.170

100+ parts

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992

$8.170

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Continental Prestige Electronics

USA . 136,788 parts In-Stock

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$0.039

136,788

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$0.039

SupplyDigital Components

Austria . 7,881 parts In-Stock

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7,881

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Kulean Microsystems

USA . 7,749 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,552 parts In-Stock

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7,552

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Problanco Electronics

Mexico . 6,382 parts In-Stock

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TANS Electronics

Latvia . 4,358 parts In-Stock

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4,358

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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220

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Overview

Enhance your electronic projects with the NSBA114YDXV6T1 by Onsemi, a top-quality Small Signal Bipolar Junction Transistor ideal for switching applications. Manufactured by a trusted name in the industry, Onsemi, this PNP transistor with built-in resistors offers reliability and performance. Its compact package shape and surface mount capability make it easy to integrate into your designs. With a maximum collector-emitter voltage of 50V and a low power dissipation of 0.5W, this transistor provides efficiency without compromising on quality. Upgrade your circuits today with the NSBA114YDXV6T1 and experience the benefits of superior technology at an affordable price.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the transistor, increasing its durability and reliability.

Polarity or Channel Type: PNP

PNP transistors are commonly used in switching applications, which makes this transistor suitable for such tasks.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

Having built-in resistors simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such tasks.

Surface Mount: YES

Surface mount capability makes it easier to integrate into modern PCB designs.

Package Shape: RECTANGULAR

Rectangular shape is optimal for efficient use of board space and placement in compact designs.

Terminal Form: FLAT

Flat terminals provide stable connections and ease of soldering during assembly.

Maximum Power Dissipation (Abs): 0.5 W

With a high maximum power dissipation, this transistor can handle higher power loads without overheating.

Minimum DC Current Gain (hFE): 80

A high minimum DC current gain ensures consistent and reliable amplification in various circuits.

Maximum Collector-Emitter Voltage: 50 V

Suitable for applications where higher voltages may be encountered, providing a safety margin.

Transistor Element Material: SILICON

Silicon transistors offer good performance characteristics and are widely used in electronic devices.

Maximum Collector Current (IC): 0.1 A

Can handle currents up to 0.1 A, making it suitable for low to medium power applications.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit layout and connections.

Maximum Time At Peak Reflow Temperature: 30 s

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature: 260 C

Compatible with standard reflow soldering processes at a peak temperature of 260 °C.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBA114YDXV6T1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 0.21

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBA114YDXV6T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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