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NSBA113EDXV6T1

Onsemi

NSBA113EDXV6T1 by Onsemi

NSBA113EDXV6T1 by Onsemi is a PNP BJT with 2 elements, built-in resistor, and max. collector-emitter voltage of 50V. Ideal for switching applications, it has a small outline package style, flat terminals, and can handle up to 0.1A collector current.

Median Price

$0.035

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44,000 parts In-Stock

1+ parts

-

100+ parts

$0.030

1k+ parts

$0.025

10k+ parts

$0.023

44,000

-

$0.030

$0.025

$0.023

DigiKey

USA . 44,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.040

44,000

-

-

-

$0.040

Verical

USA . 44,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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44,000

-

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 52 parts In-Stock

1+ parts

$0.024

100+ parts

-

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-

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52

$0.024

-

-

-

Chip Stock

USA . 71,000 parts In-Stock

1+ parts

-

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71,000

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Vyrian

USA . 7,028 parts In-Stock

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7,028

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,177 parts In-Stock

1+ parts

$0.022

100+ parts

-

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1,177

$0.022

-

-

-

Corohmni

South Africa . 491 parts In-Stock

1+ parts

$0.025

100+ parts

-

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491

$0.025

-

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-

Component Stockers USA

USA . 64,515 parts In-Stock

1+ parts

$0.030

100+ parts

$0.020

1k+ parts

$0.020

10k+ parts

$0.020

64,515

$0.030

$0.020

$0.020

$0.020

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$1.343

100+ parts

$1.222

1k+ parts

$1.101

10k+ parts

-

70

$1.343

$1.222

$1.101

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AZTECH Wire

Italy . 269 parts In-Stock

1+ parts

$15.440

100+ parts

-

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269

$15.440

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Continental Prestige Electronics

USA . 44,000 parts In-Stock

1+ parts

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100+ parts

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$0.020

44,000

-

-

-

$0.020

Authorized Procurement Solutions

USA . 22,000 parts In-Stock

1+ parts

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22,000

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Kulean Microsystems

USA . 6,707 parts In-Stock

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6,707

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TANS Electronics

Latvia . 5,205 parts In-Stock

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5,205

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SupplyDigital Components

Austria . 2,430 parts In-Stock

1+ parts

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2,430

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UHIMA Technologies

Türkiye . 981 parts In-Stock

1+ parts

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981

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Problanco Electronics

Mexico . 580 parts In-Stock

1+ parts

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580

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Overview

Unlock the power of innovation with the NSBA113EDXV6T1 by Onsemi. This high-quality Small Signal Bipolar Junction Transistor is designed for switching applications, offering customers unmatched reliability and performance. With a compact package and built-in resistor, this PNP transistor delivers seamless operation and efficient power dissipation. From industrial to automotive, the possibilities are endless with the NSBA113EDXV6T1. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: PNP

Suitable for applications where PNP transistors are required, offering flexibility in circuit design.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

Offers the convenience of having two separate elements with built-in resistors, simplifying circuit design and saving space.

Transistor Application: SWITCHING

Designed for switching applications, providing fast and efficient performance in such scenarios.

Surface Mount: YES

Allows for easy and efficient surface mounting onto PCBs, saving time and effort in assembly.

Maximum Power Dissipation (Abs): 0.5 W

Can handle up to 0.5W of power dissipation, suitable for a range of low to medium power applications.

Minimum DC Current Gain (hFE): 3

A minimum DC current gain of 3 ensures reliable amplification capabilities in various circuits.

Maximum Collector-Emitter Voltage: 50 V

With a maximum voltage rating of 50V, it can be used in circuits where higher voltage capabilities are required.

Maximum Collector Current (IC): 0.1 A

Capable of handling a maximum collector current of 0.1A, suitable for low current applications.

Peak Reflow Temperature °C: 260

Can withstand peak reflow temperatures up to 260 °C, making it suitable for reflow soldering processes.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBA113EDXV6T1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

3

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBA113EDXV6T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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