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NLX2G02CMX1TCG

Onsemi

NLX2G02CMX1TCG by Onsemi

NLX2G02CMX1TCG by Onsemi is a CMOS Logic Gates IC with 2 functions and inputs. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a propagation delay of 9.5 ns, it has a small outline package style ideal for compact designs.

Median Price

$0.188

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,990 parts In-Stock

1+ parts

$0.107

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$0.107

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Rochester

USA . 2,980 parts In-Stock

1+ parts

-

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$0.211

1k+ parts

$0.175

10k+ parts

$0.156

2,980

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$0.211

$0.175

$0.156

DigiKey

USA . 2,980 parts In-Stock

1+ parts

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$0.180

2,980

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$0.180

Verical

USA . 2,980 parts In-Stock

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$0.195

2,980

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$0.195

Distributors (In-Stock)

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Digiode

USA . 1,572 parts In-Stock

1+ parts

$0.102

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1,572

$0.102

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Vyrian

USA . 1,596 parts In-Stock

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$0.107

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1,596

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Distributors (Availability)

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Corphita

USA . 1,204 parts In-Stock

1+ parts

$0.096

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1,204

$0.096

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Corohmni

South Africa . 207 parts In-Stock

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$0.107

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207

$0.107

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Vigor

Singapore . 150 parts In-Stock

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$0.170

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150

$0.170

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Kulean Microsystems

USA . 8,341 parts In-Stock

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8,341

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Problanco Electronics

Mexico . 3,444 parts In-Stock

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Perfect Parts

USA . 3,332 parts In-Stock

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3,332

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Continental Prestige Electronics

USA . 2,980 parts In-Stock

1+ parts

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$0.150

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2,980

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$0.150

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SupplyDigital Components

Austria . 2,947 parts In-Stock

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2,947

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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648

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Microchip USA

USA . 463 parts In-Stock

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463

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TANS Electronics

Latvia . 165 parts In-Stock

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Overview

Experience top-notch quality and reliability with the NLX2G02CMX1TCG by Onsemi. As a leading manufacturer in the industry, Onsemi's logic gates are designed to deliver superior performance in various applications. This product offers customers unparalleled value with its fast propagation delay, wide operating temperature range, and compact package design. Whether you're working on military-grade projects or high-tech electronics, the NLX2G02CMX1TCG is the perfect choice for your next project. Unlock the potential of your designs with Onsemi's cutting-edge technology and innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

No. of Functions: 2

Provides versatility in terms of logical operations that can be performed.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage level.

Propagation Delay (tpd): 9.5 ns

Ensures fast processing speeds for logic operations.

Maximum Operating Temperature: 125 °C

Suitable for a wide range of operating environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLX2G02CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G02CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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