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NLX2G02BMX1TCG

Onsemi

NLX2G02BMX1TCG by Onsemi

NLX2G02BMX1TCG by Onsemi is a CMOS Logic Gate with 2 functions and inputs, operating at temperatures from -55 to 125 °C. It has a propagation delay of 9.5 ns, suitable for military-grade applications requiring fast response times in compact spaces. This surface-mount device features a small outline package with very thin profile, ideal for space-constrained designs where high reliability is crucial.

Median Price

$0.203

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

6,000

-

$0.211

$0.175

$0.156

Verical

USA . 6,000 parts In-Stock

1+ parts

-

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$0.195

6,000

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-

-

$0.195

Distributors (In-Stock)

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Digiode

USA . 981 parts In-Stock

1+ parts

$0.173

100+ parts

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981

$0.173

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Vyrian

USA . 338 parts In-Stock

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$0.176

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338

$0.176

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Distributors (Availability)

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Corphita

USA . 2,399 parts In-Stock

1+ parts

$0.164

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2,399

$0.164

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Vigor

Singapore . 159 parts In-Stock

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$0.170

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159

$0.170

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Corohmni

South Africa . 417 parts In-Stock

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$0.176

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417

$0.176

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Component Stockers USA

USA . 5,491 parts In-Stock

1+ parts

$0.180

100+ parts

$0.170

1k+ parts

$0.150

10k+ parts

-

5,491

$0.180

$0.170

$0.150

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Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

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$0.150

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6,000

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$0.150

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Kulean Microsystems

USA . 4,703 parts In-Stock

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4,703

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SupplyDigital Components

Austria . 3,894 parts In-Stock

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Problanco Electronics

Mexico . 1,698 parts In-Stock

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TANS Electronics

Latvia . 645 parts In-Stock

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Microchip USA

USA . 464 parts In-Stock

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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Overview

Unlock the power of innovative technology with the NLX2G02BMX1TCG by Onsemi. This high-quality logic gate offers unparalleled reliability and precision, making it the perfect choice for a wide range of applications. From consumer electronics to industrial automation, this product delivers exceptional performance and efficiency. Trust in Onsemi's expertise and experience to bring you cutting-edge solutions that will take your projects to the next level. Elevate your designs with the NLX2G02BMX1TCG and experience the difference superior quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the logic gates.

Surface Mount: YES

Surface mount capability allows for easy integration into electronic circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in a single device can reduce the need for additional components and decrease overall complexity of the circuit design.

No. of Inputs: 2

The two inputs provide flexibility for various logic operations and allow for more complex logical calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems and power sources.

Propagation Delay (tpd): 9.5 ns

Low propagation delay ensures fast response times in logical operations, making the product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the logic gates can withstand elevated environmental conditions and maintain reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates efficient and reliable.

Technical Specifications

Logic Gates NLX2G02BMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G02BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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