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NLX2G02AMX1TCG

Onsemi

NLX2G02AMX1TCG by Onsemi

NLX2G02AMX1TCG by Onsemi is a CMOS Logic Gate with 2 functions and inputs, operating at temperatures from -55 to 125 °C. With a propagation delay of 9.5 ns, it has a supply voltage range of 1.65V to 5.5V, making it ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.195

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

6,000

-

$0.211

$0.175

$0.156

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

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$0.180

6,000

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$0.180

Verical

USA . 6,000 parts In-Stock

1+ parts

-

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$0.195

6,000

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$0.195

Distributors (In-Stock)

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Digiode

USA . 2,245 parts In-Stock

1+ parts

$0.164

100+ parts

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2,245

$0.164

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Vyrian

USA . 2,247 parts In-Stock

1+ parts

$0.173

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2,247

$0.173

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Distributors (Availability)

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Corphita

USA . 1,051 parts In-Stock

1+ parts

$0.156

100+ parts

-

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1,051

$0.156

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Vigor

Singapore . 134 parts In-Stock

1+ parts

$0.170

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134

$0.170

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Corohmni

South Africa . 129 parts In-Stock

1+ parts

$0.173

100+ parts

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129

$0.173

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QUARKTWIN TECHNOLOGY LTD

USA . 23,655 parts In-Stock

1+ parts

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23,655

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Kulean Microsystems

USA . 7,443 parts In-Stock

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7,443

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Continental Prestige Electronics

USA . 6,000 parts In-Stock

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$0.150

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6,000

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$0.150

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TANS Electronics

Latvia . 5,461 parts In-Stock

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5,461

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Microchip USA

USA . 4,050 parts In-Stock

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SupplyDigital Components

Austria . 2,969 parts In-Stock

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2,969

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Problanco Electronics

Mexico . 1,885 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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931

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Overview

Enhance your electronic projects with the NLX2G02AMX1TCG by Onsemi, a high-quality Logic Gates component that offers exceptional reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this product boasts a wide range of applications and is designed to meet the needs of various projects. With its advanced technology and military-grade temperature grade, this Logic Gates component provides customers with unparalleled value, benefits, and advantages. Upgrade your designs with the NLX2G02AMX1TCG and experience the difference in quality and efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 2

Having 2 functions in one component reduces the need for additional components, simplifying circuit design and saving space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this logic gate compatible with standard digital systems, offering versatility in circuit design.

Propagation Delay (tpd): 9.5 ns

With a low propagation delay, this logic gate ensures fast signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this logic gate to be used in a wide range of environmental conditions, increasing its reliability and versatility.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity, making it energy-efficient and reliable in digital circuitry.

Technical Specifications

Logic Gates NLX2G02AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G02AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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