Loading...

NLX2G00AMX1TCG

Onsemi

NLX2G00AMX1TCG by Onsemi

NLX2G00AMX1TCG by Onsemi is a CMOS Logic Gates IC with 2 functions and inputs. It operates b/w -55 to 125 °C, with a propagation delay of 10.5 ns. Ideal for military-grade applications requiring small outline packages and low power consumption.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

3,000

-

$0.092

$0.077

$0.068

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,140 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$0.072

-

-

-

Vyrian

USA . 6,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,869

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,615 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

-

10k+ parts

-

1,615

$0.068

-

-

-

Vigor

Singapore . 321 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$0.070

-

-

-

Corohmni

South Africa . 495 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$0.076

-

-

-

AZTECH Wire

Italy . 1,219 parts In-Stock

1+ parts

$12.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,219

$12.020

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$24.303

100+ parts

$22.116

1k+ parts

$19.928

10k+ parts

-

5,000

$24.303

$22.116

$19.928

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,252

-

-

-

-

Kulean Microsystems

USA . 3,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,166

-

-

-

-

TANS Electronics

Latvia . 1,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,674

-

-

-

-

Microchip USA

USA . 456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

456

-

-

-

-

Problanco Electronics

Mexico . 396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

396

-

-

-

-

Metaverse IC Inc.

Canada . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

280

-

-

-

-

Kepictronics

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

SupplyDigital Components

Austria . 156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

156

-

-

-

-

UHIMA Technologies

Türkiye . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49

-

-

-

-

Overview

Discover the NLX2G00AMX1TCG by Onsemi, a top-quality logic gate that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is perfect for a wide range of applications. With its advanced technology and durable construction, the NLX2G00AMX1TCG provides customers with exceptional value and benefits. Whether you're in need of fast and efficient processing or reliable circuitry, this logic gate has got you covered. Upgrade your projects today with the NLX2G00AMX1TCG and experience the difference it can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the logic gate.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on printed circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having 2 functions in a single component offers more functionality and efficiency in circuit design.

No. of Inputs: 2

The logic gate with 2 inputs allows for basic logic operations to be performed effectively.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the logic gate into various circuit layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal voltage of 1.8V makes this logic gate compatible with low-power applications.

Propagation Delay (tpd): 10.5 ns

Low propagation delay of 10.5 ns ensures fast response times for logic operations.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55 °C ensures functionality even in extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gate energy efficient and reliable.

Technical Specifications

Logic Gates NLX2G00AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G00AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19