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NLX2G00CMX1TCG

Onsemi

NLX2G00CMX1TCG by Onsemi

NLX2G00CMX1TCG by Onsemi is a CMOS Logic Gates IC with 2 functions and inputs. It operates b/w -55 to 125 °C, with a propagation delay of 10.5 ns. Ideal for military-grade applications due to its small outline package and nickel/palladium/gold terminal finish.

Median Price

$0.134

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,698 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

8,698

-

$0.132

$0.110

$0.098

Verical

USA . 8,550 parts In-Stock

1+ parts

-

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$0.137

8,550

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$0.137

Distributors (In-Stock)

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Digiode

USA . 1,733 parts In-Stock

1+ parts

$0.103

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1,733

$0.103

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J2 Sourcing AB

Sweden . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 4,204 parts In-Stock

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4,204

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,413 parts In-Stock

1+ parts

$0.092

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8,413

$0.092

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Corphita

USA . 329 parts In-Stock

1+ parts

$0.097

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329

$0.097

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Vigor

Singapore . 189 parts In-Stock

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$0.100

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189

$0.100

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Corohmni

South Africa . 419 parts In-Stock

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$0.108

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419

$0.108

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AZTECH Wire

Italy . 430 parts In-Stock

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$17.160

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430

$17.160

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Continental Prestige Electronics

USA . 8,698 parts In-Stock

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$0.094

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8,698

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$0.094

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Perfect Parts

USA . 5,309 parts In-Stock

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Problanco Electronics

Mexico . 4,776 parts In-Stock

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Kulean Microsystems

USA . 3,610 parts In-Stock

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3,610

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TANS Electronics

Latvia . 2,674 parts In-Stock

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2,674

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SupplyDigital Components

Austria . 1,714 parts In-Stock

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1,714

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UHIMA Technologies

Türkiye . 963 parts In-Stock

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963

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Microchip USA

USA . 450 parts In-Stock

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450

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Overview

Experience the superior quality and reliability of Onsemi with the NLX2G00CMX1TCG Logic Gates. Perfect for a wide range of applications, this product offers customers unmatched value and benefits. With a package style that is both compact and durable, this logic gates device provides fast propagation delay and operates seamlessly in extreme temperatures. Trust Onsemi to deliver high-performance solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product reliable and easy to handle.

Surface Mount: YES

Allows for easy and efficient mounting on printed circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy efficient and ideal for portable devices.

Propagation Delay (tpd): 10.5 ns

Fast propagation delay ensures quick processing of signals, enhancing overall performance.

Maximum Operating Temperature: 125 °C

Ability to withstand high temperatures, suitable for industrial and harsh environmental conditions.

Technology: CMOS

CMOS technology offers high noise immunity, low power consumption, and wide operating voltage range, making it a reliable and efficient choice.

Technical Specifications

Logic Gates NLX2G00CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G00CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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