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NLX2G04CMX1TCG

Onsemi

NLX2G04CMX1TCG by Onsemi

NLX2G04CMX1TCG by Onsemi is a Logic Gates IC with 8.4ns Propagation Delay, 1.8V Nominal Voltage, and 15pF Load Capacitance. Ideal for military applications due to its -55 to 125 °C operating temperature range and small outline package style.

Median Price

$0.122

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 224,165 parts In-Stock

1+ parts

-

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$0.132

1k+ parts

$0.110

10k+ parts

$0.098

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$0.132

$0.110

$0.098

DigiKey

USA . 224,165 parts In-Stock

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$0.110

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$0.110

Verical

USA . 224,165 parts In-Stock

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$0.122

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$0.122

Distributors (In-Stock)

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Digiode

USA . 1,762 parts In-Stock

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$0.103

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1,762

$0.103

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Vyrian

USA . 1,078 parts In-Stock

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$0.108

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J2 Sourcing AB

Sweden . 29,950 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 6,500 parts In-Stock

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6,500

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Distributors (Availability)

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Corphita

USA . 535 parts In-Stock

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$0.097

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535

$0.097

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Vigor

Singapore . 705 parts In-Stock

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$0.100

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705

$0.100

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Corohmni

South Africa . 266 parts In-Stock

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$0.108

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266

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Component Stockers USA

USA . 173,510 parts In-Stock

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$0.110

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$0.100

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$0.090

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$0.090

173,510

$0.110

$0.100

$0.090

$0.090

Continental Prestige Electronics

USA . 224,137 parts In-Stock

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$0.094

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224,137

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Problanco Electronics

Mexico . 5,358 parts In-Stock

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Kulean Microsystems

USA . 4,625 parts In-Stock

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Perfect Parts

USA . 3,847 parts In-Stock

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SupplyDigital Components

Austria . 2,531 parts In-Stock

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TANS Electronics

Latvia . 513 parts In-Stock

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513

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Microchip USA

USA . 452 parts In-Stock

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452

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UHIMA Technologies

Türkiye . 277 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the NLX2G04CMX1TCG by Onsemi, a leading manufacturer in the industry. This versatile logic gate offers lightning-fast propagation delay and a compact design, making it perfect for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional performance and efficiency. Elevate your projects with the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 8.4 ns

Low propagation delay ensures fast response times and efficient processing.

No. of Functions: 2

Having multiple functions in one component can save space and reduce the need for additional components.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, which can help reduce power consumption and heat generation.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact and thin package design allows for easy integration in tight spaces and lightweight devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a variety of environments and applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLX2G04CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

8.4 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G04CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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