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NLV17SZ00DFT2G

Onsemi

NLV17SZ00DFT2G by Onsemi

NLV17SZ00DFT2G by Onsemi is a logic gate with 2 inputs and a propagation delay of 5.2 ns. It operates at a nominal voltage of 1.8 V and is suitable for applications in the military, automotive, and industrial sectors.

Median Price

$0.046

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,620 parts In-Stock

1+ parts

$0.134

100+ parts

$0.105

1k+ parts

-

10k+ parts

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9,620

$0.134

$0.105

-

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DigiKey

USA . 3,750 parts In-Stock

1+ parts

$0.330

100+ parts

$0.107

1k+ parts

$0.068

10k+ parts

$0.049

3,750

$0.330

$0.107

$0.068

$0.049

Rochester

USA . 230,634 parts In-Stock

1+ parts

-

100+ parts

$0.046

1k+ parts

$0.038

10k+ parts

$0.034

230,634

-

$0.046

$0.038

$0.034

Verical

USA . 84,000 parts In-Stock

1+ parts

-

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$0.042

84,000

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$0.042

Farnell

UK . 42,523 parts In-Stock

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42,523

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Chip1Stop

Japan . 9,000 parts In-Stock

1+ parts

-

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$0.044

9,000

-

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$0.044

Mouser Electronics

USA . 183 parts In-Stock

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$0.046

183

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$0.046

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,281 parts In-Stock

1+ parts

$0.035

100+ parts

-

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1,281

$0.035

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.155

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700

$0.155

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Vyrian

USA . 16,196 parts In-Stock

1+ parts

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16,196

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J2 Sourcing AB

Sweden . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Semicontronic

India . 16,341 parts In-Stock

1+ parts

$0.031

100+ parts

$0.030

1k+ parts

$0.030

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16,341

$0.031

$0.030

$0.030

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Ampacity Inc.

Singapore . 16,169 parts In-Stock

1+ parts

$0.031

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16,169

$0.031

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Corphita

USA . 77 parts In-Stock

1+ parts

$0.033

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77

$0.033

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Corohmni

South Africa . 258 parts In-Stock

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$0.037

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258

$0.037

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Vigor

Singapore . 859 parts In-Stock

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$0.110

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859

$0.110

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Argo Parts USA

USA . 980 parts In-Stock

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$0.155

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$0.150

980

$0.155

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$0.150

Aztec Data Supply Inc.

USA . 118 parts In-Stock

1+ parts

$16.720

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118

$16.720

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Perfect Parts

USA . 19,712 parts In-Stock

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Continental Prestige Electronics

USA . 12,523 parts In-Stock

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$0.045

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12,523

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$0.045

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TANS Electronics

Latvia . 7,142 parts In-Stock

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Kulean Microsystems

USA . 4,029 parts In-Stock

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Problanco Electronics

Mexico . 3,590 parts In-Stock

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3,590

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Authorized Procurement Solutions

USA . 2,850 parts In-Stock

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2,850

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SupplyDigital Components

Austria . 1,144 parts In-Stock

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UHIMA Technologies

Türkiye . 361 parts In-Stock

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Overview

Discover the NLV17SZ00DFT2G by Onsemi, a high-quality logic gate with countless advantages. As a manufacturer, Onsemi is known for their commitment to excellence and innovation. This logic gate is perfect for a wide range of applications, offering impressive speed and reliability. Its compact design and surface mount feature make it easy to integrate into any project. With a nominal supply voltage of 1.8V and a low power consumption of only 0.01mA, this product offers exceptional value and efficiency. Experience the benefits of the NLV17SZ00DFT2G and unlock new possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to environmental factors.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast processing of signals.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into electronic circuits.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and performance in automotive applications.

No. of Inputs: 2

2 inputs allow for versatile logic operations.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission.

No. of Terminals: 5

5 terminals provide easy connectivity options.

Maximum I (ol): 24 Amp

High output current capability for driving external loads.

Propagation Delay (tpd): 12 ns

Low propagation delay ensures fast response times.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatility in various environments.

Minimum Operating Temperature: -55 °C

Operational in extreme cold temperatures.

Terminal Finish: MATTE TIN

Matte tin finish for reliable electrical connections.

Terminal Position: DUAL

Dual terminal position for easy installation.

Maximum Seated Height: 1.1 mm

Low seated height for compact design requirements.

Width: 1.25 mm

Small width for space-efficient PCB layout.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage for energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate reflow time for proper solder joint formation.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering.

Length: 2 mm

Compact length for space-saving designs.

Temperature Grade: MILITARY

Military-grade temperature tolerance for rugged applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mechanical strength.

Packing Method: TR

TR packing method for convenient packaging and storage.

Terminal Pitch: 0.65 mm

Small terminal pitch for high-density PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage for flexible power requirements.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current for energy-efficient operation.

Technical Specifications

Logic Gates NLV17SZ00DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

12 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV17SZ00DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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