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NLV14077BDR2G

Onsemi

NLV14077BDR2G by Onsemi

NLV14077BDR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 350 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and is AEC-Q100 screened for automotive applications. The package style is small outline with dual terminal position and matte tin finish.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,305 parts In-Stock

1+ parts

-

100+ parts

$0.260

1k+ parts

$0.216

10k+ parts

$0.192

14,305

-

$0.260

$0.216

$0.192

Verical

USA . 12,553 parts In-Stock

1+ parts

-

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$0.240

12,553

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$0.240

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.164

100+ parts

-

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10

$0.164

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Digiode

USA . 996 parts In-Stock

1+ parts

$0.201

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996

$0.201

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Vyrian

USA . 12,742 parts In-Stock

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12,742

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Distributors (Availability)

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Argo Parts USA

USA . 574 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

574

$0.164

-

-

$0.159

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.164

100+ parts

-

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50

$0.164

-

-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$0.167

100+ parts

$0.167

1k+ parts

$0.167

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-

2,000

$0.167

$0.167

$0.167

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Ampacity Inc.

Singapore . 12,736 parts In-Stock

1+ parts

$0.180

100+ parts

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12,736

$0.180

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Semicontronic

India . 12,686 parts In-Stock

1+ parts

$0.180

100+ parts

$0.176

1k+ parts

$0.175

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-

12,686

$0.180

$0.176

$0.175

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Corphita

USA . 2,394 parts In-Stock

1+ parts

$0.191

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2,394

$0.191

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Vigor

Singapore . 668 parts In-Stock

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$0.200

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668

$0.200

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Corohmni

South Africa . 185 parts In-Stock

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$0.212

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185

$0.212

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Aztec Data Supply Inc.

USA . 319 parts In-Stock

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$31.606

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319

$31.606

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Continental Prestige Electronics

USA . 14,305 parts In-Stock

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$0.210

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14,305

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$0.210

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Kulean Microsystems

USA . 7,138 parts In-Stock

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Problanco Electronics

Mexico . 6,527 parts In-Stock

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6,527

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SupplyDigital Components

Austria . 5,443 parts In-Stock

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5,443

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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298

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TANS Electronics

Latvia . 278 parts In-Stock

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278

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Overview

Unleash the power of innovation with the NLV14077BDR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality logic gates designed to streamline operations and enhance efficiency across various applications. With a focus on high performance and reliability, this product boasts unmatched value, offering customers the benefits of precision, speed, and durability. Say goodbye to downtime and hello to seamless functionality with the NLV14077BDR2G. Upgrade your systems today and experience the difference that Onsemi logic gates can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 350 ns

With a fast propagation delay, this logic gate ensures quick processing of signals, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this logic gate is easy to install and saves space on PCBs, making it suitable for compact designs.

No. of Functions: 4

This logic gate offers multiple functions in a single package, reducing the need for additional components and simplifying circuit design.

Screening Level: AEC-Q100

This product meets AEC-Q100 standards, ensuring high reliability and performance in harsh automotive environments.

No. of Inputs: 2

With two input channels, this logic gate can process multiple signals simultaneously, enhancing its versatility in circuit applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into PCB layouts, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage, this logic gate is compatible with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can effectively drive capacitive loads, ensuring reliable signal transmission.

Power Supplies (V): 5/15

This logic gate is compatible with both 5V and 15V power supplies, offering flexibility in design and compatibility with various systems.

No. of Terminals: 14

With 14 terminals, this logic gate provides multiple connection points, enabling complex circuit configurations and signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs and enhances thermal dissipation, making this product ideal for compact designs.

Propagation Delay (tpd): 350 ns

The 350 ns propagation delay ensures quick signal processing, making this logic gate suitable for real-time applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate can withstand harsh environmental conditions, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -55 °C

Operating down to -55°C, this logic gate is suitable for use in a wide range of temperature conditions, making it versatile in various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and enhances solderability, ensuring long-term reliability in electronic assemblies.

Terminal Position: DUAL

With dual terminal positions, this logic gate offers flexibility in PCB layout and enables efficient signal routing for optimized performance.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm allows for compact PCB designs and reduces the overall form factor of electronic devices.

Width: 3.9 mm

With a width of 3.9 mm, this logic gate is space-efficient and can be easily integrated into tight PCB layouts, maximizing design flexibility.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V, this logic gate is energy-efficient and suitable for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this logic gate can withstand high-temperature soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of the logic gate onto PCBs, ensuring secure and durable connections.

Length: 8.65 mm

The compact length of 8.65 mm makes this logic gate suitable for space-constrained applications and allows for easy integration into tight layouts.

Temperature Grade: MILITARY

With a military-grade temperature rating, this logic gate is built to withstand extreme conditions and ensure reliable performance in demanding environments.

Technology: CMOS

Built using CMOS technology, this logic gate offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering, ensuring reliable connections in electronic assemblies.

Packing Method: TR

Packed in tape and reel format, this logic gate is easy to handle, store, and assemble, ensuring convenience in manufacturing processes.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this logic gate offers precise and secure connections, enhancing signal integrity and reliability in circuit designs.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this logic gate can handle high-power applications and offers compatibility with a wide range of power sources.

Technical Specifications

Logic Gates NLV14077BDR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14077BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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