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NLV14011BDR2G

Onsemi

NLV14011BDR2G by Onsemi

NLV14011BDR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 250ns propagation delay at 5V. Suitable for military applications, it has a temperature range of -55 to 125 °C and AEC-Q100 screening level.

Median Price

$0.209

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 167 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

$0.486

10k+ parts

$0.194

167

$1.050

-

$0.486

$0.194

Rochester

USA . 33,403 parts In-Stock

1+ parts

-

100+ parts

$0.223

1k+ parts

$0.185

10k+ parts

$0.165

33,403

-

$0.223

$0.185

$0.165

Verical

USA . 27,155 parts In-Stock

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$0.195

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$0.195

DigiKey

USA . 5,000 parts In-Stock

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$0.120

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$0.120

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Vyrian

USA . 2,019 parts In-Stock

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$0.151

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2,019

$0.151

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Digiode

USA . 855 parts In-Stock

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$0.174

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855

$0.174

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Flip Electronics

USA . 5,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 24,947 parts In-Stock

1+ parts

$0.128

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24,947

$0.128

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Corohmni

South Africa . 179 parts In-Stock

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$0.151

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Corphita

USA . 2,143 parts In-Stock

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$0.165

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Vigor

Singapore . 222 parts In-Stock

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$0.200

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$0.200

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Continental Prestige Electronics

USA . 6,248 parts In-Stock

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$0.182

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6,248

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Problanco Electronics

Mexico . 5,890 parts In-Stock

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SupplyDigital Components

Austria . 4,088 parts In-Stock

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Kulean Microsystems

USA . 2,609 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 1,236 parts In-Stock

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UHIMA Technologies

Türkiye . 904 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the NLV14011BDR2G Logic Gates. With a wide range of applications, this product offers exceptional performance and value for customers seeking top-tier components. Trust in Onsemi's reputation for excellence and innovation, providing you with peace of mind knowing you have a superior product at your disposal. Choose NLV14011BDR2G for your next project and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 250 ns

The low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having four functions in one component saves space on the circuit board and simplifies the overall design.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates that the product meets automotive industry standards for reliability and performance in harsh environments.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common and widely supported voltage level, making this product compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps improve signal integrity and reduce power consumption in the circuit.

Power Supplies (V): 5/15

The ability to operate on both 5V and 15V power supplies provides flexibility in design and compatibility with different systems.

No. of Inputs: 2

Having two inputs allows for simple logic operations, providing versatile functionality for various applications.

Package Shape: RECTANGULAR

The rectangular package shape is easy to handle and can be efficiently mounted on a circuit board, optimizing space utilization.

Technical Specifications

Logic Gates NLV14011BDR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14011BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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