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NLV14023BCPG

Onsemi

NLV14023BCPG by Onsemi

NLV14023BCPG by Onsemi is a CMOS Logic Gates IC with 3 functions, 3 inputs, and 300 ns propagation delay at 5V. AEC-Q100 screening makes it ideal for military applications requiring -55 to 125 °C operating temperature range. Package style is in-line with through-hole terminals, suitable for various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 597 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 7,098 parts In-Stock

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TANS Electronics

Latvia . 5,027 parts In-Stock

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Kulean Microsystems

USA . 4,592 parts In-Stock

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Problanco Electronics

Mexico . 914 parts In-Stock

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Corphita

USA . 475 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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UHIMA Technologies

Türkiye . 391 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NLV14023BCPG logic gates by Onsemi. Crafted with precision and expertise, this product offers unparalleled quality and reliability for a wide range of applications. Elevate your projects with the value and benefits that only Onsemi can provide, from improved performance to enhanced efficiency. Experience the advantages of seamless integration and seamless operation, making the NLV14023BCPG a must-have for all your electronic needs. Trust in Onsemi for excellence in every circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 300 ns

With a fast propagation delay of 300 ns, this product ensures quick response times and efficient operation.

No. of Functions: 3

Having 3 functions in one package offers versatility and flexibility in circuit design.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps in reducing signal distortion and improving overall performance.

Power Supplies (V): 5/15

Support for dual power supplies at 5V and 15V adds flexibility in system integration and operation.

No. of Terminals: 14

The product's 14 terminals provide ample connectivity options for interfacing with other components.

Maximum Operating Temperature: 125 °C

Operating efficiently at temperatures up to 125 °C enables it to be used in harsh environments and industrial settings.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, the product is suitable for cold temperature applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and compatibility with various logic levels.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy and reliable PCB mounting for secure connections.

Technical Specifications

Logic Gates NLV14023BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

NLV14023BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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