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NLV14011BDG

Onsemi

NLV14011BDG by Onsemi

NLV14011BDG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 250ns propagation delay at 5V. Suitable for military applications due to AEC-Q100 screening level and -55 to 125 °C operating temperature range.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 12,265 parts In-Stock

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USA . 12,265 parts In-Stock

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Vyrian

USA . 2,383 parts In-Stock

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USA . 12,265 parts In-Stock

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Digiode

USA . 1,332 parts In-Stock

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Vigor

Singapore . 138 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Kulean Microsystems

USA . 5,709 parts In-Stock

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SupplyDigital Components

Austria . 4,010 parts In-Stock

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Problanco Electronics

Mexico . 3,115 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,349 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Overview

Enhance your electronic projects with the NLV14011BDG by Onsemi, a top-quality logic gate designed to deliver exceptional performance and reliability. Manufactured by Onsemi, a trusted industry leader known for their cutting-edge technologies and innovative solutions, this logic gate is perfect for a wide range of applications. With a compact design and fast propagation delay, this product offers unparalleled value and benefits to customers looking for high-quality components. Upgrade your projects today with the NLV14011BDG and experience the advantages of using top-tier electronics from a reputable manufacturer like Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 250 ns

The low propagation delay ensures fast and efficient operation of the logic gates.

Surface Mount: YES

The surface mount option allows for easy and convenient installation on circuit boards.

No. of Functions: 4

Having multiple functions in one package allows for more versatile use and efficient space utilization.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates high reliability and quality standards for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is commonly used in many electronic systems, ensuring compatibility with existing setups.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and improving overall circuit performance.

Power Supplies (V): 5/15

Having power supply options of 5V and 15V provides flexibility in designing and implementing different types of circuits.

No. of Inputs: 2

With 2 input logic gates, this product is suitable for basic logical operations in digital circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on PCBs.

Technical Specifications

Logic Gates NLV14011BDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14011BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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