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NLV14001BDG

Onsemi

NLV14001BDG by Onsemi

NLV14001BDG by Onsemi is a CMOS Logic Gates with 4 functions, 2 inputs, and 250ns propagation delay at 5V. It operates in temperature range of -55 to 125 °C and is AEC-Q100 certified for automotive applications.

Median Price

$0.246

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 13,915 parts In-Stock

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$0.200

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Flip Electronics (Authorized)

USA . 13,915 parts In-Stock

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Rochester

USA . 60 parts In-Stock

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$0.292

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$0.243

10k+ parts

$0.216

60

-

$0.292

$0.243

$0.216

Distributors (In-Stock)

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Vyrian

USA . 569 parts In-Stock

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$0.200

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569

$0.200

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Digiode

USA . 1,339 parts In-Stock

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$0.228

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$0.228

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Flip Electronics

USA . 13,915 parts In-Stock

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13,915

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,148 parts In-Stock

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$0.170

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Corohmni

South Africa . 178 parts In-Stock

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178

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Corphita

USA . 807 parts In-Stock

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$0.216

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807

$0.216

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Vigor

Singapore . 182 parts In-Stock

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$0.240

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TANS Electronics

Latvia . 7,576 parts In-Stock

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Problanco Electronics

Mexico . 5,011 parts In-Stock

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SupplyDigital Components

Austria . 4,427 parts In-Stock

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UHIMA Technologies

Türkiye . 779 parts In-Stock

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Kulean Microsystems

USA . 534 parts In-Stock

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Microchip USA

USA . 259 parts In-Stock

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Overview

Experience seamless performance with the NLV14001BDG logic gate by Onsemi. Crafted with precision and reliability, this product offers unparalleled quality and durability. Ideal for a variety of applications, this logic gate provides exceptional value and efficiency to customers. Unlock the potential of your projects with the advantages and benefits of this top-tier product from a trusted manufacturer like Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 250 ns

Fast propagation delay ensures quick response time, making it suitable for high-speed applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Capable of performing multiple logic functions, offering versatility and flexibility in circuit design.

No. of Inputs: 2

Suitable for basic logic operations with two input signals.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, making it compatible with a wide range of circuits.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature environments, offering versatility in usage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates NLV14001BDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14001BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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