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NLV14011UBDG

Onsemi

NLV14011UBDG by Onsemi

NLV14011UBDG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 180ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and is suitable for military-grade applications requiring AEC-Q100 screening.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,087 parts In-Stock

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Digiode

USA . 2,417 parts In-Stock

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Vigor

Singapore . 821 parts In-Stock

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$0.240

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AZTECH Wire

Italy . 1,158 parts In-Stock

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$8.520

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Kulean Microsystems

USA . 7,712 parts In-Stock

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TANS Electronics

Latvia . 2,689 parts In-Stock

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SupplyDigital Components

Austria . 2,545 parts In-Stock

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Corphita

USA . 1,035 parts In-Stock

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Problanco Electronics

Mexico . 870 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 264 parts In-Stock

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UHIMA Technologies

Türkiye . 200 parts In-Stock

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Overview

Enhance your electronic designs with the NLV14011UBDG by Onsemi, a top-quality logic gate that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile component is ideal for a wide range of applications. With its advanced technology and durable construction, the NLV14011UBDG delivers exceptional value and benefits to customers looking for superior functionality and efficiency. Upgrade your projects today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 180 ns

The low propagation delay ensures efficient signal processing and quick response times.

Surface Mount: YES

Surface mount design makes it easy to integrate into electronic circuit boards, saving space and simplifying assembly.

No. of Functions: 4

With multiple functions in one component, this product offers versatility and efficiency in circuit design.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive applications.

No. of Inputs: 2

Having two inputs allows for more complex logic operations and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with many electronic systems and easy to integrate.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable operation and optimal performance in various applications.

Power Supplies (V): 5/15

Compatibility with multiple power supply voltages allows for more versatile system integration and operation.

No. of Terminals: 14

Having multiple terminals provides connectivity options and flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on circuit boards, ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation in both extreme cold and hot environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions make it easier to connect and secure the component on the circuit board.

Maximum Seated Height: 1.75 mm

Low seated height allows for a compact and slim design, suitable for space-constrained applications.

Width: 3.9 mm

Narrow width saves space on the circuit board, enabling more efficient layout and design.

Minimum Supply Voltage (Vsup): 3 V

The lower minimum supply voltage allows for operation in low-power scenarios, increasing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering without damaging the component during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the component can withstand the soldering process without issues.

Length: 8.65 mm

The specified length provides a compact form factor, suitable for smaller electronic devices and tight spaces.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions and critical applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for various electronic applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy surface mounting and soldering, enhancing manufacturability and reliability.

Packing Method: RAIL

Rail packing provides efficient handling, storage, and organization of the components during manufacturing and distribution.

Terminal Pitch: 1.27 mm

The specified terminal pitch offers compatibility with standard PCB layouts and facilitates easy connections in circuit designs.

Maximum Supply Voltage (Vsup): 18 V

With a high maximum supply voltage, the component can be used in a wide range of electronic systems and power configurations.

Technical Specifications

Logic Gates NLV14011UBDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

180 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14011UBDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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