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NBSG53AMAG

Onsemi

NBSG53AMAG by Onsemi

NBSG53AMAG clock driver by Onsemi features a propagation delay of 0.27 ns, operates at a nominal voltage of 2.5V, and offers differential input conditioning. This device is suitable for applications requiring precise clock signal distribution in electronic systems with surface mount requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,010 parts In-Stock

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Digiode

USA . 1,693 parts In-Stock

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AZTECH Wire

Italy . 276 parts In-Stock

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$20.350

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Component Stockers USA

USA . 749 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 8,165 parts In-Stock

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Problanco Electronics

Mexico . 3,738 parts In-Stock

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Kulean Microsystems

USA . 1,818 parts In-Stock

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TANS Electronics

Latvia . 1,814 parts In-Stock

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Corphita

USA . 702 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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Microchip USA

USA . 428 parts In-Stock

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UHIMA Technologies

Türkiye . 377 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the NBSG53AMAG clock driver by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge solutions for your clock drivers and buffers needs. This innovative product offers exceptional performance with a propagation delay of only 0.275 ns, making it ideal for applications requiring precision timing. With its differential input conditioning and wide range of power supply options, the NBSG53AMAG provides unmatched versatility and flexibility. Trust Onsemi to provide you with a superior product that meets your demands for high-speed data transmission and synchronization. Elevate your designs with the NBSG53AMAG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.275 ns

Low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps reduce noise and improve signal integrity, making this clock driver ideal for precision timing applications.

Nominal Supply Voltage / Vsup (V): 2.5

Stable 2.5V supply voltage ensures consistent performance and compatibility with a wide range of systems.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Multiple power supply options allow for flexible integration into different voltage systems, increasing versatility and compatibility.

Maximum Operating Temperature: 70 °C

High maximum operating temperature provides reliability in various environmental conditions, increasing the overall durability of the product.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes, ensuring proper soldering and assembly of the clock driver.

Technical Specifications

Clock Drivers & Buffers NBSG53AMAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

53

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.275 ns

Propagation Delay (tpd):

.27 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.03 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Trade Compliance

NBSG53AMAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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