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NBSG16VSMN

Onsemi

NBSG16VSMN by Onsemi

NBSG16VSMN by Onsemi is a Line Transceiver IC with differential output and input characteristics. It operates in industrial temperature grade range (-40 to 85 °C) with max supply voltage of 3.465 V. This surface mount chip carrier has a square package shape, 16 terminals, and very thin profile for high-speed data transmission applications.

Median Price

$17.516

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 404 parts In-Stock

1+ parts

-

100+ parts

$15.570

1k+ parts

$13.930

10k+ parts

$13.110

404

-

$15.570

$13.930

$13.110

Verical

USA . 404 parts In-Stock

1+ parts

-

100+ parts

$19.462

1k+ parts

$17.413

10k+ parts

$16.387

404

-

$19.462

$17.413

$16.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,634 parts In-Stock

1+ parts

$16.464

100+ parts

-

1k+ parts

-

10k+ parts

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1,634

$16.464

-

-

-

Vyrian

USA . 4,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,544

-

-

-

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ComSIT Distribution GmbH

Germany . 90 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 495 parts In-Stock

1+ parts

$14.680

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$14.680

-

-

-

Corphita

USA . 839 parts In-Stock

1+ parts

$15.597

100+ parts

-

1k+ parts

-

10k+ parts

-

839

$15.597

-

-

-

AZTECH Wire

Italy . 146 parts In-Stock

1+ parts

$20.640

100+ parts

-

1k+ parts

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146

$20.640

-

-

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SupplyDigital Components

Austria . 7,889 parts In-Stock

1+ parts

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7,889

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Problanco Electronics

Mexico . 7,213 parts In-Stock

1+ parts

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7,213

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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100+ parts

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7,000

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TANS Electronics

Latvia . 4,551 parts In-Stock

1+ parts

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4,551

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Kulean Microsystems

USA . 2,023 parts In-Stock

1+ parts

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2,023

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A-Z Elektronik GmbH

Germany . 1,844 parts In-Stock

1+ parts

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1,844

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Continental Prestige Electronics

USA . 404 parts In-Stock

1+ parts

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100+ parts

$14.150

1k+ parts

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404

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$14.150

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UHIMA Technologies

Türkiye . 372 parts In-Stock

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372

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Perfect Parts

USA . 124 parts In-Stock

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124

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Microchip USA

USA . 106 parts In-Stock

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106

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Overview

Discover the NBSG16VSMN by Onsemi, a top-tier line driver & receiver that promises unparalleled quality and reliability. Designed with the latest technology and manufactured by industry leaders, this surface-mount device offers exceptional performance in various applications. With a maximum supply voltage of 3.465 V and a wide temperature range, customers can trust in its seamless operation. Experience the benefits of fast transmit delay, differential outputs, and minimal power consumption. Elevate your projects with the NBSG16VSMN and enjoy the value it brings to your work.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes installation and assembly easier and more efficient, saving time and labor costs.

Maximum Supply Voltage: 3.465 V

Can handle a relatively high supply voltage, suitable for various applications requiring this level of voltage.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, especially when multiple components need to be placed close together.

Maximum Transmit Delay: 0.18 ns

Low transmit delay ensures fast and efficient data transmission, crucial for high-speed applications.

Power Supplies (V): +-2.5/+-3.3

Supports a wide range of power supply voltages, making it versatile and compatible with different systems.

No. of Terminals: 16

Having a sufficient number of terminals allows for flexibility in connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer options based on thermal management requirements and space constraints in various applications.

Maximum High Level Input Current: 0.0001 Amp

Low input current ensures power efficiency and helps prevent damage from excessive current in the input signal.

Minimum Supply Voltage: 2.375 V

Can operate at a relatively low supply voltage, suitable for applications where power efficiency is critical.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, suitable for applications in harsh weather conditions or cold storage environments.

Terminal Finish: Tin/Lead (Sn90Pb10)

Tin/lead terminal finish provides good solderability and conductivity, ensuring reliable connections in various operating conditions.

Terminal Position: QUAD

Quad terminal position allows for easier PCB layout and routing, optimizing the design for efficient signal flow.

Maximum Seated Height: 1 mm

Low seated height saves space on the PCB, ideal for compact designs or applications with height restrictions.

Width: 3 mm

Compact width makes the component suitable for use in space-constrained designs or densely populated circuit boards.

Differential Output: YES

Differential output helps minimize noise and interference, ensuring reliable data transmission and reception.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes the risk of thermal damage during assembly processes, ensuring component reliability.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance allows for lead-free soldering processes, meeting environmental regulations and industry standards.

Length: 3 mm

Compact length makes the component suitable for use in space-constrained designs or densely populated circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Maximum Receive Delay: 0.18 ns

Low receive delay ensures fast and efficient data reception, essential for high-speed communication applications.

Terminal Form: NO LEAD

No-lead terminal form supports RoHS compliance and modern soldering processes, improving environmental sustainability and manufacturing efficiency.

Input Characteristics: DIFFERENTIAL

Differential input helps reject common-mode noise and interference, improving signal integrity and overall system performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with devices operating at this voltage level.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compatibility with modern PCB design requirements.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type provides bidirectional communication capabilities, making it suitable for networking and data transfer applications.

Technical Specifications

Line Drivers & Receivers NBSG16VSMN attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.18 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn90Pb10)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.18 ns

Width:

3 mm

Trade Compliance

NBSG16VSMN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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