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NBSG16MNR2

Onsemi

NBSG16MNR2 by Onsemi

NBSG16MNR2 by Onsemi is a Line Transceiver with ECL technology. It operates at -40 to 85 °C, with supply voltage range of +-2.5/+-3.3 V. With max transmit delay of 0.145 ns, it's ideal for high-speed data transmission applications.

Median Price

$31.522

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

18,000

-

$28.020

$25.070

$23.590

Verical

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

18,000

-

$35.025

$31.337

$29.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 811 parts In-Stock

1+ parts

$29.650

100+ parts

-

1k+ parts

-

10k+ parts

-

811

$29.650

-

-

-

Vyrian

USA . 6,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,447

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 640 parts In-Stock

1+ parts

$13.450

100+ parts

-

1k+ parts

-

10k+ parts

-

640

$13.450

-

-

-

Corohmni

South Africa . 116 parts In-Stock

1+ parts

$26.430

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$26.430

-

-

-

Corphita

USA . 946 parts In-Stock

1+ parts

$28.089

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$28.089

-

-

-

Component Stockers USA

USA . 13,311 parts In-Stock

1+ parts

$32.270

100+ parts

$30.340

1k+ parts

$27.430

10k+ parts

$27.430

13,311

$32.270

$30.340

$27.430

$27.430

Continental Prestige Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$25.480

10k+ parts

-

18,000

-

-

$25.480

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,869

-

-

-

-

SupplyDigital Components

Austria . 5,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,219

-

-

-

-

Microchip USA

USA . 4,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,906

-

-

-

-

Perfect Parts

USA . 2,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,984

-

-

-

-

Kulean Microsystems

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,040

-

-

-

-

TANS Electronics

Latvia . 878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

878

-

-

-

-

Problanco Electronics

Mexico . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

435

-

-

-

-

UHIMA Technologies

Türkiye . 73 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

73

-

-

-

-

Overview

Enhance your electronic designs with the NBSG16MNR2 by Onsemi, a top-quality line driver and receiver that sets the standard for reliability and performance. Manufactured by industry leader Onsemi, this surface-mount device offers seamless communication and precision in a compact square package. Perfect for a wide range of applications, this advanced technology provides unparalleled value, benefits, and advantages to customers seeking efficient and dependable solutions for their projects. Upgrade your systems with the NBSG16MNR2 and experience the difference in quality and innovation today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and enhancing durability.

Maximum Supply Voltage: 3.465 V

Supports a wide range of operating voltages, increasing compatibility with various systems.

Package Shape: SQUARE

Square package shape is commonly used for integrated circuits, providing a compact and efficient design.

Maximum Transmit Delay: 0.145 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): +-2.5/+-3.3

Support for dual power supplies offers flexibility in powering the device.

No. of Terminals: 16

Sufficient number of terminals for interfacing with other components or devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles provide options for different application requirements.

Minimum Supply Voltage: 2.375 V

Wide range of supply voltage support ensures reliable operation even at lower voltages.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for use in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn90Pb10)

Tin/lead finish provides good electrical conductivity and solderability.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections on the PCB.

Maximum Seated Height: 1 mm

Low seated height allows for compact device placement and efficient use of space.

Width: 3 mm

Narrow width enables space-saving installation on PCBs.

Differential Output: YES

Differential output helps reduce noise and improve signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal time for peak reflow temperature ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 235

High peak reflow temperature supports lead-free soldering processes.

Length: 3 mm

Compact length allows for space-efficient placement on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Maximum Receive Delay: 0.145 ns

Low receive delay ensures fast and accurate reception of data.

Technology: ECL

Use of ECL technology offers high-speed performance and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and improves reliability.

Input Characteristics: DIFFERENTIAL

Differential input allows for noise rejection and improved signal quality.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance under varying conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact design and high-density PCB layout.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional data transmission and reception.

Technical Specifications

Line Drivers & Receivers NBSG16MNR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn90Pb10)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.145 ns

Width:

3 mm

Trade Compliance

NBSG16MNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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