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NBSG16BA100

Onsemi

NBSG16BA100 by Onsemi

NBSG16BA100 by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.14 ns and differential output. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,292 parts In-Stock

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Digiode

USA . 1,155 parts In-Stock

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Problanco Electronics

Mexico . 7,002 parts In-Stock

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SupplyDigital Components

Austria . 4,914 parts In-Stock

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TANS Electronics

Latvia . 3,627 parts In-Stock

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Kulean Microsystems

USA . 3,038 parts In-Stock

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Corphita

USA . 1,507 parts In-Stock

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UHIMA Technologies

Türkiye . 406 parts In-Stock

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Corohmni

South Africa . 351 parts In-Stock

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Overview

Elevate your communication with the NBSG16BA100 by Onsemi, a top-quality line driver and receiver that delivers unparalleled performance. Manufactured by industry leader Onsemi, this product is designed for reliability and precision. Perfect for a wide range of applications, this versatile component offers customers unmatched value and benefits. Whether you're looking to enhance your data transmission or streamline your system, the NBSG16BA100 provides the advantage you need to stay ahead in today's fast-paced world. Trust Onsemi to deliver excellence with every product, including the NBSG16BA100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package light-weight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.465 V

Support for a high maximum supply voltage provides flexibility in various power supply configurations.

Package Shape: SQUARE

The square package shape allows for easier placement and alignment on the PCB, optimizing layout design.

Maximum Transmit Delay: 0.14 ns

Ultra-low transmit delay ensures fast signal transmission, making it suitable for high-speed data communication.

Power Supplies (V): +-2.5/+-3.3

Support for dual power supplies at +/-2.5V and +/-3.3V enables compatibility with a wide range of systems.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and interfaces for various input and output configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The low profile grid array package style saves space and allows for dense packing of components on the PCB.

Maximum High Level Input Current: 0.0001 Amp

The low maximum high level input current helps in reducing power consumption and heat dissipation in the system.

Minimum Supply Voltage: 2.375 V

Support for a low minimum supply voltage ensures operation in low-power or battery-powered applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and enhances the reliability of the solder joints during assembly.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB mounting and soldering processes.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for a slim and compact design, saving space in the overall product layout.

Width: 4 mm

The narrow width of 4mm enables efficient space utilization on the PCB and facilitates compact system designs.

Differential Output: YES

Differential output helps in reducing electromagnetic interference and noise, ensuring high signal integrity in communication.

Length: 4 mm

The short length of 4mm contributes to a compact form factor, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with wide temperature fluctuations.

Maximum Receive Delay: 0.14 ns

Ultra-low receive delay ensures minimal signal distortion and ensures high-speed data reception.

Terminal Form: BALL

Ball terminal form provides good electrical contact and reliability in the connection, enhancing the overall performance.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and provide better signal quality in noisy environments.

Nominal Supply Voltage: 2.5 V

Support for a nominal supply voltage of 2.5V ensures compatibility with standard power supply configurations.

Terminal Pitch: 1 mm

The tight terminal pitch of 1mm allows for high-density mounting and enhances signal integrity in the system.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC ensures efficient and reliable communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers NBSG16BA100 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375V TO -3.465V SUPPLY IN ECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.14 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.14 ns

Width:

4 mm

Trade Compliance

NBSG16BA100 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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