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NBSG16VSBA

Onsemi

NBSG16VSBA by Onsemi

NBSG16VSBA by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.145 ns and differential output for industrial applications. The package style is grid array, low profile, with a terminal pitch of 1 mm and moisture sensitivity level of 3.

Median Price

$118.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 41 parts In-Stock

1+ parts

$118.790

100+ parts

-

1k+ parts

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10k+ parts

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41

$118.790

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-

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Verical

USA . 41 parts In-Stock

1+ parts

$146.474

100+ parts

-

1k+ parts

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10k+ parts

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41

$146.474

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-

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Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$15.570

1k+ parts

$13.930

10k+ parts

$13.110

1

-

$15.570

$13.930

$13.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 890 parts In-Stock

1+ parts

$16.464

100+ parts

-

1k+ parts

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890

$16.464

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-

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Vyrian

USA . 4,677 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,677

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,213 parts In-Stock

1+ parts

$15.597

100+ parts

-

1k+ parts

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10k+ parts

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1,213

$15.597

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-

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Corohmni

South Africa . 469 parts In-Stock

1+ parts

$17.330

100+ parts

-

1k+ parts

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10k+ parts

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469

$17.330

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-

-

SupplyDigital Components

Austria . 4,980 parts In-Stock

1+ parts

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100+ parts

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4,980

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Kulean Microsystems

USA . 3,297 parts In-Stock

1+ parts

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100+ parts

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3,297

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TANS Electronics

Latvia . 3,162 parts In-Stock

1+ parts

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3,162

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Problanco Electronics

Mexico . 539 parts In-Stock

1+ parts

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539

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Microchip USA

USA . 354 parts In-Stock

1+ parts

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100+ parts

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354

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UHIMA Technologies

Türkiye . 220 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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220

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Overview

Discover the NBSG16VSBA by Onsemi, a top-notch line driver & receiver that promises unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry known for their innovative solutions, this product is perfect for a wide range of applications. With its advanced features and cutting-edge technology, this line driver & receiver offers unmatched value to customers. Experience seamless communication and enhanced performance with the NBSG16VSBA – your ultimate solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 3.465 V

High maximum supply voltage ensures compatibility with a wide range of applications.

Package Shape: SQUARE

Square shape allows for efficient use of space and easy placement on circuit boards.

Maximum Transmit Delay: 0.145 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): +-2.5/+-3.3

Wide power supply range allows for flexible compatibility with different power sources.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for different system configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array, low profile package style helps in saving space and enables compact designs.

Maximum High Level Input Current: 0.00015 Amp

Low high level input current ensures efficient power consumption and reduces heat generation.

Minimum Supply Voltage: 2.375 V

Having a low minimum supply voltage allows for operation in lower power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without performance issues.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position helps in easy soldering and connection to circuit boards.

Maximum Seated Height: 1.4 mm

Low seated height allows for slim and compact designs within electronic devices.

Width: 4 mm

Compact width enables easy integration into tight spaces or densely populated circuits.

Differential Output: YES

Differential output provides noise immunity and improved signal integrity in data transmission.

Length: 4 mm

Short length helps in space-saving and efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments.

Maximum Receive Delay: 0.145 ns

Low receive delay ensures fast processing of incoming data signals.

Terminal Form: BALL

Ball terminal form provides secure and reliable connection points for external components.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal quality in data reception.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5V allows for stable and consistent performance in typical operating conditions.

Terminal Pitch: 1 mm

Having a 1mm terminal pitch provides adequate spacing for easy soldering and connection.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate moisture exposure during handling and storage.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures compatibility with various communication protocols and systems.

Technical Specifications

Line Drivers & Receivers NBSG16VSBA attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.145 ns

Width:

4 mm

Trade Compliance

NBSG16VSBA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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