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NBSG16MAG

Onsemi

NBSG16MAG by Onsemi

NBSG16MAG by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.14 ns and differential output for industrial applications. The package is a thin profile grid array measuring 4x4 mm, suitable for surface mount assembly.

Median Price

-

Lifecycle Status

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In-Stock Inventory

< 1k

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USA . 472 parts In-Stock

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Digiode

USA . 314 parts In-Stock

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314

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Problanco Electronics

Mexico . 7,845 parts In-Stock

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TANS Electronics

Latvia . 7,776 parts In-Stock

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SupplyDigital Components

Austria . 2,722 parts In-Stock

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Kulean Microsystems

USA . 2,572 parts In-Stock

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Corphita

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Corohmni

South Africa . 349 parts In-Stock

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UHIMA Technologies

Türkiye . 187 parts In-Stock

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Overview

Enhance your electronic designs with the NBSG16MAG by Onsemi, a top-of-the-line line driver and receiver that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product is perfect for a wide range of applications, delivering fast and efficient signal transmission. With a sleek square package body and advanced surface mount technology, the NBSG16MAG provides customers with exceptional value and performance. Upgrade your projects today with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort during the assembly process.

Maximum Supply Voltage: 3.465 V

Can handle high supply voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

Compact design allows for space-saving installation in tight spaces.

Maximum Transmit Delay: 0.14 ns

Provides fast and efficient data transmission, resulting in improved overall performance.

Power Supplies (V): +-2.5/+-3.3

Supports a range of power supplies, allowing for flexibility in system design.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components, enhancing versatility.

Package Style (Meter): GRID ARRAY, THIN PROFILE

Compact and slim profile facilitates easy integration into compact electronic devices.

Maximum High Level Input Current: 0.0001 Amp

Low input current consumption helps in reducing power consumption and operating costs.

Minimum Supply Voltage: 2.375 V

Works efficiently even at low supply voltages, ensuring reliable performance in various conditions.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, ideal for use in harsh environmental conditions.

Terminal Finish: MATTE TIN

Provides a consistent and reliable connection interface, ensuring long-term performance and stability.

Terminal Position: BOTTOM

Simplifies the installation process and facilitates efficient connections with other components.

Maximum Seated Height: 1.03 mm

Low profile design saves space and allows for compact device layout.

Width: 4 mm

Compact width allows for easy integration into various electronic devices and systems.

Differential Output: YES

Provides differential output signals, ensuring better noise immunity and signal integrity.

Length: 4 mm

Compact length facilitates space-saving installation in electronic devices and systems.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring consistent performance in demanding environments.

Maximum Receive Delay: 0.14 ns

Ensures fast and efficient reception of data signals, improving overall system responsiveness.

Terminal Form: BALL

Ball terminal form provides a secure and reliable connection interface, reducing the risk of signal loss or disruptions.

Input Characteristics: DIFFERENTIAL

Differential input signals offer improved noise rejection and signal integrity, enhancing overall system performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation in various applications.

Terminal Pitch: 1 mm

Optimal terminal pitch facilitates easy and reliable connections with other components, enhancing overall system reliability.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for line transceiver applications, ensuring compatibility and optimal performance in communication systems.

Technical Specifications

Line Drivers & Receivers NBSG16MAG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e3

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.14 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.14 ns

Width:

4 mm

Trade Compliance

NBSG16MAG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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