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NBSG16BA

Onsemi

NBSG16BA by Onsemi

NBSG16BA by Onsemi is a Line Transceiver with ECL technology. It features a max supply voltage of 3.465V, differential output, and a max transmit delay of 0.145ns. Ideal for industrial applications requiring high-speed data transmission in tight spaces due to its low profile grid array package style.

Median Price

$16.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

$16.220

1k+ parts

$16.220

10k+ parts

$16.220

2,063

-

$16.220

$16.220

$16.220

Rochester

USA . 2,033 parts In-Stock

1+ parts

-

100+ parts

$14.000

1k+ parts

$12.530

10k+ parts

$11.790

2,033

-

$14.000

$12.530

$11.790

Verical

USA . 1,994 parts In-Stock

1+ parts

-

100+ parts

$17.500

1k+ parts

$15.662

10k+ parts

$14.738

1,994

-

$17.500

$15.662

$14.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 816 parts In-Stock

1+ parts

$13.210

100+ parts

-

1k+ parts

-

10k+ parts

-

816

$13.210

-

-

-

Digiode

USA . 894 parts In-Stock

1+ parts

$14.820

100+ parts

-

1k+ parts

-

10k+ parts

-

894

$14.820

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 116 parts In-Stock

1+ parts

$13.210

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$13.210

-

-

-

Corphita

USA . 1,046 parts In-Stock

1+ parts

$14.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,046

$14.040

-

-

-

Problanco Electronics

Mexico . 7,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,897

-

-

-

-

SupplyDigital Components

Austria . 6,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,889

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,311

-

-

-

-

TANS Electronics

Latvia . 5,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,605

-

-

-

-

Kulean Microsystems

USA . 4,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,098

-

-

-

-

Continental Prestige Electronics

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

$12.730

1k+ parts

-

10k+ parts

-

2,063

-

$12.730

-

-

UHIMA Technologies

Türkiye . 629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

629

-

-

-

-

Microchip USA

USA . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

215

-

-

-

-

Overview

Experience unparalleled performance and reliability with the NBSG16BA by Onsemi, a leading manufacturer in the industry. This line driver & receiver is designed to deliver seamless communication in a wide range of applications. With a low profile grid array package and differential output, this product offers superior quality and functionality. Ideal for industrial use, the NBSG16BA ensures smooth operation even in extreme temperatures. Trust Onsemi's expertise and elevate your projects with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort in production.

Maximum Supply Voltage: 3.465 V

High maximum supply voltage allows for compatibility with a wide range of systems and ensures stable performance even under varying voltage conditions.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the PCB, allowing for compact and streamlined design of the overall system.

Maximum Transmit Delay: 0.145 ns

Ultra-low transmit delay ensures rapid and efficient data transmission, making the product suitable for high-speed communication applications.

Power Supplies (V): +-2.5/+-3.3

Wide range of power supply options allows for flexible integration into various systems, accommodating different voltage requirements.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options, enabling versatile and multifunctional usage of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array, low profile package style offers space-saving benefits and enhances thermal dissipation, contributing to improved overall performance.

Minimum Supply Voltage: 2.375 V

Low minimum supply voltage helps in reducing power consumption and ensures efficient operation even in low voltage conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in a wide range of environmental conditions, making the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function effectively even in extreme cold environments, enhancing its versatility.

Terminal Finish: TIN LEAD

Use of tin lead terminal finish provides good solderability and ensures secure connections, contributing to reliable and long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier assembly and wiring, simplifying installation and maintenance processes.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for compact and space-efficient design, making the product suitable for applications where size constraints are a concern.

Width: 4 mm

Compact width dimension helps in achieving a streamlined and efficient layout on the PCB, optimizing space utilization.

Differential Output: YES

Differential output capability ensures high noise immunity and signal integrity, making the product ideal for use in noisy environments or long-distance transmission.

Length: 4 mm

Short length dimension contributes to a compact and space-saving design, allowing for efficient integration into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Maximum Receive Delay: 0.145 ns

Ultra-low receive delay ensures minimal signal lag, facilitating fast and responsive data reception, crucial for real-time communication applications.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making the product suitable for applications requiring fast signal processing and efficient operation.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and simplifies soldering processes, enhancing the overall durability and performance of the product.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal quality, ensuring accurate and reliable data transmission in challenging operating environments.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage levels commonly used in electronic systems.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density integration and efficient use of PCB space, enabling compact and intricate system designs.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, necessitating appropriate handling and storage practices to maintain product integrity and reliability.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type offers versatile communication capabilities and ensures seamless connectivity with other devices, enhancing the product's compatibility and functionality.

Technical Specifications

Line Drivers & Receivers NBSG16BA attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.145 ns

Width:

4 mm

Trade Compliance

NBSG16BA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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