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NBSG16MNR2G

Onsemi

NBSG16MNR2G by Onsemi

NBSG16MNR2G by Onsemi is a Line Transceiver with ECL technology. It operates in industrial temperature range (-40 to 85 °C) and has differential outputs with max transmit delay of 0.145 ns. Suitable for applications requiring high-speed data transmission over short distances.

Median Price

$31.522

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 14,760 parts In-Stock

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14,760

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Rochester

USA . 2,862 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

2,862

-

$28.020

$25.070

$23.590

DigiKey

USA . 2,862 parts In-Stock

1+ parts

-

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2,862

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Verical

USA . 2,862 parts In-Stock

1+ parts

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100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

2,862

-

$35.025

$31.337

$29.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,926 parts In-Stock

1+ parts

$29.650

100+ parts

-

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1,926

$29.650

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Vyrian

USA . 2,232 parts In-Stock

1+ parts

$31.210

100+ parts

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2,232

$31.210

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Flip Electronics

USA . 14,185 parts In-Stock

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14,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$16.096

100+ parts

$14.647

1k+ parts

$13.199

10k+ parts

-

1,000

$16.096

$14.647

$13.199

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Corphita

USA . 1,280 parts In-Stock

1+ parts

$28.089

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1,280

$28.089

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Corohmni

South Africa . 313 parts In-Stock

1+ parts

$31.210

100+ parts

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313

$31.210

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Microchip USA

USA . 5,894 parts In-Stock

1+ parts

$64.080

100+ parts

$62.970

1k+ parts

$62.410

10k+ parts

$61.860

5,894

$64.080

$62.970

$62.410

$61.860

QUARKTWIN TECHNOLOGY LTD

USA . 27,533 parts In-Stock

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Kulean Microsystems

USA . 6,526 parts In-Stock

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6,526

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Problanco Electronics

Mexico . 5,722 parts In-Stock

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5,722

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SupplyDigital Components

Austria . 5,448 parts In-Stock

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TANS Electronics

Latvia . 465 parts In-Stock

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UHIMA Technologies

Türkiye . 29 parts In-Stock

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29

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Overview

Experience unmatched quality and performance with the NBSG16MNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Line Drivers & Receivers like no other. This versatile product is perfect for a wide range of applications, offering customers value and benefits that exceed expectations. With its surface mount capability, maximum supply voltage of 3.465 V, and a minimum operating temperature of -40 °C, the NBSG16MNR2G provides reliability and efficiency that you can count on. Trust Onsemi to provide you with cutting-edge technology that meets your needs every time.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure mounting on PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.465 V

Can handle higher supply voltages effectively, providing flexibility in power source options.

Package Shape: SQUARE

Square package shape is typically more compact and easier to align during assembly.

Maximum Transmit Delay: 0.145 ns

Low transmit delay ensures fast and efficient data transfer.

Power Supplies (V): +-2.5/+-3.3

Supports a range of power supply voltages, making it versatile in various applications.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in design and thermal management.

Minimum Supply Voltage: 2.375 V

Can operate effectively with lower supply voltages, increasing compatibility with different systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures reliability in harsh and varied conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

Durable terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for easy and secure soldering on the PCB.

Maximum Seated Height: 1 mm

Low seated height saves space and facilitates efficient board layout.

Width: 3 mm

Compact width allows for dense PCB designs and efficient use of space.

Differential Output: YES

Differential output helps in reducing noise and improving signal integrity over long distances.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and effective soldering during reflow process without damaging the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering in lead-free processes.

Length: 3 mm

Compact length contributes to overall compactness and space-saving design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Maximum Receive Delay: 0.145 ns

Low receive delay helps in maintaining synchronization in data transmission.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, suitable for demanding applications.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and complies with RoHS regulations.

Input Characteristics: DIFFERENTIAL

Differential input allows for noise reduction and improved signal quality in communication.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance in various operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, saving space and improving design flexibility.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type supports bidirectional data communication, making it suitable for various applications.

Technical Specifications

Line Drivers & Receivers NBSG16MNR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.145 ns

Width:

3 mm

Trade Compliance

NBSG16MNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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