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NBSG16MN

Onsemi

NBSG16MN by Onsemi

NBSG16MN by Onsemi is a Line Transceiver IC with ECL technology. It operates in industrial temperature range (-40 to 85 °C) and supports differential input characteristics. With a max supply voltage of 3.465 V, it offers fast transmission with 0.145 ns delay, making it ideal for high-speed communication applications.

Median Price

$15.750

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 14,760 parts In-Stock

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-

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14,760

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Rochester

USA . 6,044 parts In-Stock

1+ parts

-

100+ parts

$14.000

1k+ parts

$12.530

10k+ parts

$11.790

6,044

-

$14.000

$12.530

$11.790

Verical

USA . 2,015 parts In-Stock

1+ parts

-

100+ parts

$17.500

1k+ parts

$15.662

10k+ parts

$14.738

2,015

-

$17.500

$15.662

$14.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,210 parts In-Stock

1+ parts

$14.820

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1,210

$14.820

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Flip Electronics

USA . 14,185 parts In-Stock

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14,185

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Vyrian

USA . 3,224 parts In-Stock

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3,224

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Inventory MP

USA . 80 parts In-Stock

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80

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Bristol Electronics

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 332 parts In-Stock

1+ parts

$13.210

100+ parts

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332

$13.210

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Corphita

USA . 381 parts In-Stock

1+ parts

$14.040

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381

$14.040

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Component Stockers USA

USA . 5,946 parts In-Stock

1+ parts

$15.860

100+ parts

$14.910

1k+ parts

$13.480

10k+ parts

-

5,946

$15.860

$14.910

$13.480

-

AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$17.780

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392

$17.780

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Kepictronics

USA . 10,300 parts In-Stock

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Kulean Microsystems

USA . 8,006 parts In-Stock

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8,006

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Continental Prestige Electronics

USA . 6,126 parts In-Stock

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$12.730

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6,126

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$12.730

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QUARKTWIN TECHNOLOGY LTD

USA . 5,721 parts In-Stock

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5,721

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Microchip USA

USA . 4,315 parts In-Stock

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4,315

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 1,852 parts In-Stock

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Problanco Electronics

Mexico . 1,136 parts In-Stock

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SupplyDigital Components

Austria . 808 parts In-Stock

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808

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UHIMA Technologies

Türkiye . 316 parts In-Stock

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316

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Overview

Looking for a reliable solution for your line driver and receiver needs? Look no further than the NBSG16MN by Onsemi. With a maximum supply voltage of 3.465V and a wide operating temperature range, this IC is perfect for industrial applications. Its differential output and ECL technology ensure high-quality performance. Trust in the reputation of Onsemi to deliver top-notch products like the NBSG16MN, providing value and benefits that meet and exceed customer expectations. Choose quality, choose Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy PCB assembly and saves space on the board.

Maximum Supply Voltage: 3.465 V

Supports a wide range of voltage inputs for versatile applications.

Package Shape: SQUARE

Provides a compact and standardized form factor for consistent design.

Maximum Transmit Delay: 0.145 ns

Ensures fast data transmission with minimal delay.

Power Supplies (V): +-2.5/+-3.3

Compatible with common power supply voltages for easy integration.

No. of Terminals: 16

Offers multiple connection points for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides efficient heat dissipation and space-saving advantages.

Minimum Supply Voltage: 2.375 V

Works even with low power supply voltages for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold environments.

Terminal Finish: Tin/Lead (Sn90Pb10)

Provides a reliable connection and solder joint for long-term durability.

Terminal Position: QUAD

Quad terminal layout enables easy connectivity and signal routing.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Width: 3 mm

Compact width for efficient PCB layout and space-saving.

Differential Output: YES

Supports differential signaling for improved noise immunity and signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process.

Peak Reflow Temperature °C: 235

Withstands high reflow temperatures for lead-free soldering.

Length: 3 mm

Compact length for space-efficient design layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Maximum Receive Delay: 0.145 ns

Provides fast and efficient reception of data signals.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed performance.

Terminal Form: NO LEAD

Lead-free terminal form for RoHS compliance and environmental safety.

Input Characteristics: DIFFERENTIAL

Supports differential input signals for noise immunity and signal quality.

Nominal Supply Voltage: 2.5 V

Ideal supply voltage for efficient and stable operation.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact layout and connectivity.

Interface IC Type: LINE TRANSCEIVER

Built-in line transceiver for seamless communication and signal handling.

Technical Specifications

Line Drivers & Receivers NBSG16MN attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn90Pb10)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.145 ns

Width:

3 mm

Trade Compliance

NBSG16MN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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