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NBSG16BAHTBG

Onsemi

NBSG16BAHTBG by Onsemi

NBSG16BAHTBG by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.145 ns and differential output for industrial applications. With a package style of GRID ARRAY, LOW PROFILE, it offers a max supply voltage of 3.465 V and operates on +-2.5/+-3.3 V power supplies.

Median Price

$32.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,800 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

18,800

-

$28.020

$25.070

$23.590

DigiKey

USA . 18,800 parts In-Stock

1+ parts

-

100+ parts

$32.460

1k+ parts

$32.460

10k+ parts

$32.460

18,800

-

$32.460

$32.460

$32.460

Verical

USA . 18,800 parts In-Stock

1+ parts

-

100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

18,800

-

$35.025

$31.337

$29.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,495 parts In-Stock

1+ parts

$26.430

100+ parts

-

1k+ parts

-

10k+ parts

-

2,495

$26.430

-

-

-

Digiode

USA . 538 parts In-Stock

1+ parts

$29.650

100+ parts

-

1k+ parts

-

10k+ parts

-

538

$29.650

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 352 parts In-Stock

1+ parts

$26.430

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$26.430

-

-

-

Corphita

USA . 2,190 parts In-Stock

1+ parts

$28.089

100+ parts

-

1k+ parts

-

10k+ parts

-

2,190

$28.089

-

-

-

Continental Prestige Electronics

USA . 18,800 parts In-Stock

1+ parts

-

100+ parts

$25.480

1k+ parts

-

10k+ parts

-

18,800

-

$25.480

-

-

TANS Electronics

Latvia . 4,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,787

-

-

-

-

SupplyDigital Components

Austria . 2,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,674

-

-

-

-

Problanco Electronics

Mexico . 799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

799

-

-

-

-

Kulean Microsystems

USA . 657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

657

-

-

-

-

Microchip USA

USA . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

415

-

-

-

-

UHIMA Technologies

Türkiye . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Overview

Enhance your electronic projects with the NBSG16BAHTBG by Onsemi, a top-quality line driver & receiver offering precision and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is ideal for a wide range of applications. With its low profile grid array package style and differential output, it provides unparalleled performance. Experience seamless functionality and exceptional value with the NBSG16BAHTBG, designed to meet your needs and exceed your expectations. Elevate your projects with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Easy and convenient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.465 V

Allows for compatibility with a wide range of systems and power sources.

Package Shape: SQUARE

Helps optimize space utilization on the circuit board, especially important in compact electronic devices.

Maximum Transmit Delay: 0.145 ns

Enables fast and efficient data transmission, crucial for high-performance applications.

Power Supplies (V): +-2.5/+-3.3

Offers flexibility in power options, making it versatile for various voltage requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components, ensuring seamless integration in a circuit.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Low profile design saves space on the circuit board and enables efficient heat dissipation.

Maximum High Level Input Current: 0.0001 Amp

Efficient power consumption and low input current requirements for energy savings.

Minimum Supply Voltage: 2.375 V

Low minimum supply voltage allows for operation in systems with limited power availability.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

Able to withstand extreme cold temperatures, ideal for use in industrial or harsh environments.

Terminal Position: BOTTOM

Facilitates easy connection to other components on the circuit board for efficient signal transmission.

Maximum Seated Height: 1.4 mm

Low seated height saves space and enables compact design of electronic devices.

Width: 4 mm

Compact width allows for efficient placement on the circuit board, especially in tight spaces.

Differential Output: YES

Differential output helps reduce noise interference and improve signal integrity for reliable data transmission.

Length: 4 mm

Compact length ensures space-efficient placement on the circuit board, suitable for small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring robust performance in demanding conditions.

Maximum Receive Delay: 0.145 ns

Low receive delay ensures quick response time for receiving data, essential for time-sensitive applications.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for stable signal transmission.

Maximum Supply Current: 29 mA

Moderate supply current consumption for efficient power usage and reduced heat generation.

Input Characteristics: DIFFERENTIAL

Differential input allows for noise rejection and improved signal quality, enhancing overall performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent and reliable operation in a variety of applications.

Terminal Pitch: 1 mm

Compact terminal pitch enables close arrangement of terminals for efficient connectivity in a small space.

Interface IC Type: LINE TRANSCEIVER

Specialized interface IC type for efficient line transmission, suitable for a wide range of communication protocols.

Technical Specifications

Line Drivers & Receivers NBSG16BAHTBG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

29 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.145 ns

Width:

4 mm

Trade Compliance

NBSG16BAHTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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