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NBSG16BAR2G

Onsemi

NBSG16BAR2G by Onsemi

NBSG16BAR2G by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It offers differential output, 0.145 ns max transmit/receive delay, and supports 2.375-3.465 V supply voltage range. Ideal for industrial applications requiring high-speed data transmission in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,192 parts In-Stock

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Vyrian

USA . 53 parts In-Stock

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53

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,697 parts In-Stock

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7,697

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Kulean Microsystems

USA . 5,279 parts In-Stock

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5,279

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TANS Electronics

Latvia . 4,813 parts In-Stock

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Corphita

USA . 2,289 parts In-Stock

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SupplyDigital Components

Austria . 1,448 parts In-Stock

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Corohmni

South Africa . 450 parts In-Stock

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450

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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Overview

Unlock seamless communication and superior performance with the NBSG16BAR2G by Onsemi. Crafted with precision and expertise, this line driver & receiver boasts unparalleled quality and reliability. From industrial automation to telecommunications, this versatile product caters to a wide range of applications, ensuring optimal signal transmission with minimal delay. Experience the value of enhanced connectivity and efficiency with Onsemi's cutting-edge technology, setting new standards in the industry. Elevate your systems with the NBSG16BAR2G and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to harsh environmental conditions, making the product reliable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and making installation more efficient.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage provides flexibility in power requirements, accommodating a wide range of operating conditions.

Package Shape: SQUARE

The square package shape allows for a symmetrical and space-efficient design, aiding in layout optimization on the PCB.

Maximum Transmit Delay: 0.145 ns

The low transmit delay ensures fast and efficient data transmission, crucial for high-speed communication applications.

No. of Terminals: 16

Having a higher number of terminals allows for more connectivity options, enabling versatility in system design and integration.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage allows for operation in low-power settings, making the product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures, ensuring reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The wide temperature range of operation makes the product suitable for use in extreme cold conditions, enhancing its versatility and reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections, simplifying the assembly process and ensuring a stable electrical connection.

Maximum Seated Height: 1.4 mm

The low seated height allows for a slim profile, saving space and enabling the product to be used in compact electronic devices.

Width: 4 mm

The compact width of the product makes it suitable for applications with limited space constraints, enabling versatile integration.

Differential Output: YES

Differential output helps minimize noise and improve signal integrity, making the product ideal for applications requiring high reliability and data accuracy.

Length: 4 mm

The short length of the product contributes to its compact design, ideal for space-constrained applications and streamlined system integration.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making the product well-suited for industrial applications.

Maximum Receive Delay: 0.145 ns

The low receive delay ensures efficient data reception, complementing the fast transmit delay for seamless and high-speed communication.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, ensuring stable electrical contact and facilitating easy integration onto circuit boards.

Input Characteristics: DIFFERENTIAL

Differential input characteristics enable better noise immunity and signal integrity, enhancing the product's performance in demanding environments.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a standard operating level for compatibility with a wide range of systems, simplifying integration and deployment.

Terminal Pitch: 1 mm

The tight terminal pitch enables high-density packaging on circuit boards, maximizing space utilization and allowing for compact system designs.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type ensures compatibility with various communication protocols, making the product versatile and suitable for diverse applications.

Technical Specifications

Line Drivers & Receivers NBSG16BAR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

.145 ns

Width:

4 mm

Trade Compliance

NBSG16BAR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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