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NBSG16BA500R2

Onsemi

NBSG16BA500R2 by Onsemi

NBSG16BA500R2 by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.14 ns and differential output for industrial applications. The package style is grid array, low profile, with a terminal pitch of 1 mm and surface mount capability.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,354 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 5,601 parts In-Stock

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TANS Electronics

Latvia . 2,068 parts In-Stock

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Problanco Electronics

Mexico . 1,979 parts In-Stock

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Corphita

USA . 1,710 parts In-Stock

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SupplyDigital Components

Austria . 1,507 parts In-Stock

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UHIMA Technologies

Türkiye . 229 parts In-Stock

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Experience superior performance and reliability with the Onsemi NBSG16BA500R2 Line Driver & Receiver. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that guarantee seamless communication in various applications. Whether you're looking to enhance data transmission speed or improve signal integrity, this product offers unmatched value and benefits. Say goodbye to disruptions and hello to efficiency with the NBSG16BA500R2 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for stable and reliable operation in a wide range of electrical systems.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it suitable for space-constrained designs.

Maximum Transmit Delay: 0.14 ns

The low maximum transmit delay ensures fast and efficient signal transmission, reducing latency in communication systems.

Power Supplies (V): +-2.5/+-3.3

The flexible power supply options (+-2.5V or +-3.3V) allow compatibility with a variety of power sources, providing versatility in deployment.

No. of Terminals: 16

Having 16 terminals enables seamless connectivity and communication between different components in the system, enhancing overall performance.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers efficient heat dissipation and space-saving benefits, enabling integration in compact devices.

Maximum High Level Input Current: 0.0001 Amp

The low maximum high level input current contributes to energy efficiency and prevents excessive power consumption during operation.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in system design and implementation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments, making the product suitable for a diverse range of applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connection to the circuit board, ensuring a stable and reliable electrical interface.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a compact and streamlined design, enhancing the overall aesthetics and functionality of the product.

Width: 4 mm

The narrow width allows for efficient space utilization on the circuit board, enabling dense packing of components for optimized layout and performance.

Differential Output: YES

The differential output ensures high signal integrity and noise immunity, making the product suitable for applications where data accuracy is critical.

Length: 4 mm

The short length of the product contributes to a compact form factor, enabling integration into small devices or tight spaces.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Maximum Receive Delay: 0.14 ns

The low maximum receive delay contributes to minimal signal latency, ensuring real-time data transmission and high-speed performance.

Terminal Form: BALL

The ball terminal form provides a secure and robust connection to the circuit board, offering enhanced mechanical stability and longevity.

Input Characteristics: DIFFERENTIAL

The use of differential input characteristics allows for noise rejection and improved signal quality, making the product ideal for high-fidelity applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides a standard operating level that is commonly used in many electronic systems, ensuring compatibility with existing hardware.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for precise and secure connections to the circuit board, facilitating easy integration and system reliability.

Interface IC Type: LINE TRANSCEIVER

The type of interface IC as a line transceiver enables bidirectional communication between different parts of the system, ensuring seamless data exchange and interoperability.

Technical Specifications

Line Drivers & Receivers NBSG16BA500R2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375V TO -3.465V SUPPLY IN ECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.14 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.14 ns

Width:

4 mm

Trade Compliance

NBSG16BA500R2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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