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NBSG16MNG

Onsemi

NBSG16MNG by Onsemi

NBSG16MNG by Onsemi is a Line Transceiver IC with ECL technology. It operates in industrial temperature range (-40 to 85°C) and has a max supply voltage of 3.465V. With differential outputs, it is suitable for applications requiring fast data transmission with minimal delay, such as high-speed communication systems.

Median Price

$31.522

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$40.620

100+ parts

$31.770

1k+ parts

$29.040

10k+ parts

-

40

$40.620

$31.770

$29.040

-

DigiKey

USA . 14,760 parts In-Stock

1+ parts

-

100+ parts

$26.000

1k+ parts

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10k+ parts

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14,760

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$26.000

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Flip Electronics (Authorized)

USA . 14,760 parts In-Stock

1+ parts

-

100+ parts

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14,760

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Rochester

USA . 3,998 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

3,998

-

$28.020

$25.070

$23.590

Verical

USA . 2,668 parts In-Stock

1+ parts

-

100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

2,668

-

$35.025

$31.337

$29.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 808 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

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808

$26.000

-

-

-

Digiode

USA . 568 parts In-Stock

1+ parts

$29.650

100+ parts

-

1k+ parts

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10k+ parts

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568

$29.650

-

-

-

Flip Electronics

USA . 14,185 parts In-Stock

1+ parts

-

100+ parts

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14,185

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Zilex Electronics Inc.

Canada . 4 parts In-Stock

1+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,559 parts In-Stock

1+ parts

$22.100

100+ parts

-

1k+ parts

-

10k+ parts

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6,559

$22.100

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-

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Corohmni

South Africa . 367 parts In-Stock

1+ parts

$26.000

100+ parts

-

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367

$26.000

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Corphita

USA . 1,494 parts In-Stock

1+ parts

$28.089

100+ parts

-

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10k+ parts

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1,494

$28.089

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Kulean Microsystems

USA . 7,563 parts In-Stock

1+ parts

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7,563

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SupplyDigital Components

Austria . 6,478 parts In-Stock

1+ parts

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6,478

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TANS Electronics

Latvia . 5,748 parts In-Stock

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5,748

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Microchip USA

USA . 5,069 parts In-Stock

1+ parts

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5,069

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Problanco Electronics

Mexico . 4,880 parts In-Stock

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4,880

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Continental Prestige Electronics

USA . 4,149 parts In-Stock

1+ parts

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100+ parts

$24.500

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4,149

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$24.500

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Kepictronics

USA . 168 parts In-Stock

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168

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Perfect Parts

USA . 16 parts In-Stock

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16

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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14

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Overview

Discover the cutting-edge NBSG16MNG by Onsemi, a top-of-the-line line driver & receiver that sets the standard for quality and reliability. With a sleek square package design and advanced ECL technology, this product offers seamless communication with a maximum transmit delay of only 0.145 ns. Perfect for industrial applications, the NBSG16MNG operates flawlessly in extreme temperatures and provides differential output for superior performance. Trust Onsemi's expertise and elevate your projects with the exceptional value and benefits of the NBSG16MNG.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient mounting on a PCB, saving space and making installation simpler.

Maximum Supply Voltage: 3.465 V

Provides a wide operating range for flexibility in various applications.

Package Shape: SQUARE

Square package shape aids in efficient PCB layout and design.

Maximum Transmit Delay: 0.145 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): +-2.5/+-3.3

Dual power supply options provide versatility and compatibility with different voltage requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting various components in the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles offer flexibility in installation and heat dissipation options.

Minimum Supply Voltage: 2.375 V

Low minimum supply voltage allows for operation in lower voltage environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold temperatures.

Terminal Finish: NICKEL GOLD PALLADIUM

High-quality terminal finish for improved durability and performance.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections.

Maximum Seated Height: 1 mm

Low seated height helps in compact and space-saving designs.

Width: 3 mm

Compact width for efficient PCB layout and space utilization.

Differential Output: YES

Differential output for improved noise rejection and signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper reflow soldering for reliable connections during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for lead-free soldering processes.

Length: 3 mm

Compact length ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for robust performance in harsh industrial environments.

Maximum Receive Delay: 0.145 ns

Low receive delay for fast and efficient data reception.

Technology: ECL

ECL technology for high-speed and high-frequency applications.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations.

Input Characteristics: DIFFERENTIAL

Differential input for noise immunity and signal quality enhancement.

Nominal Supply Voltage: 2.5 V

Stable and reliable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and high-density PCB layout.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type for efficient communication between systems or devices.

Technical Specifications

Line Drivers & Receivers NBSG16MNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.145 ns

Width:

3 mm

Trade Compliance

NBSG16MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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