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NBSG16MNHTBG

Onsemi

NBSG16MNHTBG by Onsemi

NBSG16MNHTBG by Onsemi is a Line Transceiver IC with differential output. It operates in industrial temperature range (-40 to 85 °C) and has a max supply voltage of 3.465 V. With a package style of CHIP CARRIER, it is suitable for applications requiring high-speed data transmission.

Median Price

$31.522

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 14,760 parts In-Stock

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14,760

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Rochester

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

1,700

-

$28.020

$25.070

$23.590

DigiKey

USA . 1,700 parts In-Stock

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1,700

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Verical

USA . 1,700 parts In-Stock

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100+ parts

$35.025

1k+ parts

$31.337

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1,700

-

$35.025

$31.337

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,532 parts In-Stock

1+ parts

$29.650

100+ parts

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1,532

$29.650

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Vyrian

USA . 827 parts In-Stock

1+ parts

$31.210

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827

$31.210

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Flip Electronics

USA . 14,185 parts In-Stock

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14,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 748 parts In-Stock

1+ parts

$28.089

100+ parts

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748

$28.089

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Corohmni

South Africa . 155 parts In-Stock

1+ parts

$31.210

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155

$31.210

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Problanco Electronics

Mexico . 7,300 parts In-Stock

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7,300

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Kulean Microsystems

USA . 6,052 parts In-Stock

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6,052

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SupplyDigital Components

Austria . 5,655 parts In-Stock

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Microchip USA

USA . 3,791 parts In-Stock

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TANS Electronics

Latvia . 2,704 parts In-Stock

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2,704

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UHIMA Technologies

Türkiye . 75 parts In-Stock

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75

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Overview

Unlock unparalleled performance and reliability with the NBSG16MNHTBG by Onsemi. Designed with precision and expertise, this line driver & receiver boasts cutting-edge technology that ensures seamless data transmission in a variety of applications. From industrial automation to telecommunications, this product offers unmatched value, efficiency, and versatility. Elevate your projects with Onsemi's superior quality components and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a circuit board.

Maximum Supply Voltage: 3.465 V

Provides a high maximum supply voltage for reliable performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Maximum Transmit Delay: 0.145 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): +-2.5/+-3.3

Supports a wide range of power supplies for flexibility in usage.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles provide options for different application scenarios.

Maximum High Level Input Current: 0.0001 Amp

Low input current ensures energy efficiency.

Minimum Supply Voltage: 2.375 V

Allows for operation even at low supply voltages.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables use in extreme conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

Quality terminal finish for durability and long-term performance.

Terminal Position: QUAD

Quad terminal position allows for easy connection to other components.

Maximum Seated Height: 1 mm

Low seated height for compact design and space-saving on the board.

Width: 3 mm

Compact width for efficient use of board space.

Differential Output: YES

Differential output for noise reduction and improved signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliability in manufacturing processes.

Length: 3 mm

Compact length for space-saving on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh environments.

Maximum Receive Delay: 0.145 ns

Low receive delay for efficient data reception.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly design.

Maximum Supply Current: 29 mA

Low supply current for energy-efficient operation.

Input Characteristics: DIFFERENTIAL

Differential input for noise immunity and high signal quality.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Compact terminal pitch for efficient connection layout on the board.

Interface IC Type: LINE TRANSCEIVER

Specialized interface IC type for efficient line communication.

Technical Specifications

Line Drivers & Receivers NBSG16MNHTBG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

29 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.145 ns

Width:

3 mm

Trade Compliance

NBSG16MNHTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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