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MAX3232EIPWRE4

Texas Instruments

MAX3232EIPWRE4 by Texas Instruments

MAX3232EIPWRE4 by Texas Instruments is a Line Driver & Receiver with 16 terminals. It operates at 3.3/5V, has a max supply voltage of 3.6V, and supports EIA-232-F, TIA-232-F, V.28 interface standards. Ideal for industrial applications requiring reliable data transmission over long distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,960 parts In-Stock

1+ parts

-

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7,960

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Digiode

USA . 3,565 parts In-Stock

1+ parts

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3,565

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 923 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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923

$0.500

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Semicontronic

India . 1,459 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,459

$3.500

$3.412

$3.395

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Parana Technologies

USA . 1,786 parts In-Stock

1+ parts

$4.424

100+ parts

-

1k+ parts

$4.849

10k+ parts

-

1,786

$4.424

-

$4.849

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$4.971

100+ parts

-

1k+ parts

$4.474

10k+ parts

-

2,292

$4.971

-

$4.474

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ChromeModa Solutions

Germany . 1,622 parts In-Stock

1+ parts

$4.971

100+ parts

$4.076

1k+ parts

-

10k+ parts

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1,622

$4.971

$4.076

-

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AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$7.891

100+ parts

-

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405

$7.891

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Corohmni

South Africa . 1,025 parts In-Stock

1+ parts

$8.136

100+ parts

-

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10k+ parts

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1,025

$8.136

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-

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$16.964

100+ parts

$15.437

1k+ parts

$13.910

10k+ parts

-

900

$16.964

$15.437

$13.910

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Ampacity Inc.

Singapore . 848 parts In-Stock

1+ parts

$30.500

100+ parts

-

1k+ parts

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10k+ parts

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848

$30.500

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Continental Prestige Electronics

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Corphita

USA . 1,330 parts In-Stock

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1,330

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DigiPath Technology Company

USA . 1,188 parts In-Stock

1+ parts

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100+ parts

$4.482

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1,188

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$4.482

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iodParts Technologies Inc.

India . 1,133 parts In-Stock

1+ parts

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1,133

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

1+ parts

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1,000

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Argo Parts USA

USA . 846 parts In-Stock

1+ parts

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846

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$0.160

1k+ parts

$0.160

10k+ parts

$0.160

300

-

$0.160

$0.160

$0.160

Overview

Enhance your electronic designs with the MAX3232EIPWRE4 by Texas Instruments, a top-of-the-line line driver and receiver. Crafted with precision by a trusted manufacturer, this versatile component offers superior performance in a variety of applications. With a compact design and reliable functionality, customers can count on seamless integration and enhanced efficiency. Elevate your projects with the MAX3232EIPWRE4 and experience the quality and value that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and resistant to damage, ensuring longevity and reliability.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources, increasing versatility.

No. of Functions: 2

Having multiple functions in a single device enhances functionality and efficiency, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of handling and integration into electronic circuits, simplifying installation.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages gives flexibility in different operating environments and applications, making it adaptable.

No. of Terminals: 16

With 16 terminals, the product enables various connections and interfaces, offering compatibility with a range of devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space and ensures efficient use of PCB real estate.

Maximum High Level Input Current: 0.000001 Amp

The extremely low high level input current minimizes power consumption and enhances energy efficiency.

Minimum Supply Voltage: 3 V

Having a minimum supply voltage of 3V ensures reliable operation within specified parameters, enhancing performance.

Maximum Operating Temperature: 85 °C

Being able to operate at a maximum temperature of 85°C ensures stability and reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operating down to -40°C allows for usage in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connection options, allowing for versatile and customizable circuit designs.

Maximum Seated Height: 1.2 mm

With a low seated height of 1.2mm, the product is suitable for compact designs and reduces overall profile for space-constrained applications.

Width: 4.4 mm

The narrow width of 4.4mm makes the product suitable for densely populated PCB layouts, optimizing space usage.

Maximum Output Low Current: 1.6 Amp

A maximum output low current of 1.6A allows for driving power-hungry loads with ease, ensuring reliable performance.

Receiver No. of Bits: 2

Having 2 bits in the receiver enhances data processing capabilities, making the product ideal for communication applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures proper soldering and component bonding during assembly, guaranteeing product reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260°C allows for soldering in high-temperature reflow processes, ensuring strong and reliable connections.

Length: 5 mm

The compact length of 5mm saves space on the PCB, allowing for efficient layout and integration in tight spaces.

Minimum Out Swing: 10 V

With a minimum out swing of 10V, the product ensures signal integrity and compatibility with a wide range of devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliable operation in harsh environments, making the product suitable for industrial applications.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time signal transmission and reception, ideal for applications requiring immediate data transfer.

Terminal Form: GULL WING

The gull-wing terminal form offers secure soldering connections and mechanical stability, ensuring robust performance in demanding conditions.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Supporting multiple interface standards allows for compatibility with various communication protocols, enhancing connectivity options.

Maximum Supply Current: 1 mA

The low maximum supply current of 1mA minimizes power consumption, making the product energy-efficient and cost-effective.

Input Characteristics: SCHMITT TRIGGER

Featuring Schmitt trigger input characteristics improves noise immunity and signal stability, ensuring reliable operation in noisy environments.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures consistent performance within specified voltage ranges, enhancing reliability.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for fine-pitch connections, enabling high-density PCB layouts and compact designs.

Driver No. of Bits: 2

With 2 bits in the driver, the product can handle complex data processing and signal transmission, making it suitable for high-speed applications.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver interface IC type allows for bidirectional signal transmission, making the product versatile and suitable for communication applications.

Technical Specifications

Line Drivers & Receivers MAX3232EIPWRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MAX3232EIPWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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