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NBSG16MMNR2

Onsemi

NBSG16MMNR2 by Onsemi

NBSG16MMNR2 by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It has a max supply voltage of 3.465 V and differential output capability. Ideal for industrial applications requiring fast transmission speeds with minimal delay (0.155 ns) in a compact chip carrier package (3x3 mm).

Median Price

$15.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50,800 parts In-Stock

1+ parts

-

100+ parts

$14.000

1k+ parts

$12.530

10k+ parts

$11.790

50,800

-

$14.000

$12.530

$11.790

Verical

USA . 47,800 parts In-Stock

1+ parts

-

100+ parts

$17.500

1k+ parts

$15.662

10k+ parts

$14.738

47,800

-

$17.500

$15.662

$14.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,214 parts In-Stock

1+ parts

$14.820

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$14.820

-

-

-

Vyrian

USA . 6,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,283

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 190 parts In-Stock

1+ parts

$13.210

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$13.210

-

-

-

AZTECH Wire

Italy . 586 parts In-Stock

1+ parts

$13.220

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$13.220

-

-

-

Corphita

USA . 1,906 parts In-Stock

1+ parts

$14.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,906

$14.040

-

-

-

Continental Prestige Electronics

USA . 50,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.730

10k+ parts

-

50,800

-

-

$12.730

-

TANS Electronics

Latvia . 4,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,702

-

-

-

-

Kulean Microsystems

USA . 2,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,638

-

-

-

-

SupplyDigital Components

Austria . 2,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,339

-

-

-

-

Problanco Electronics

Mexico . 1,667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,667

-

-

-

-

UHIMA Technologies

Türkiye . 223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

223

-

-

-

-

Microchip USA

USA . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

185

-

-

-

-

Overview

Elevate your electronic designs with the NBSG16MMNR2 by Onsemi, a top-of-the-line line driver & receiver that promises unrivaled quality and performance. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in the market. With applications across various industries, this line transceiver offers seamless integration and reliable communication. Experience the value of precision engineering and cutting-edge technology with the NBSG16MMNR2, providing customers with unparalleled benefits and advantages they won't find elsewhere. Upgrade your projects today with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to physical damage, making the product suitable for a variety of environments.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.465 V

With a high maximum supply voltage, this product can handle a range of power inputs without risk of damage.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, making it a compact and practical choice.

Maximum Transmit Delay: 0.155 ns

This low transmit delay ensures rapid and efficient data transmission, enhancing overall performance.

Power Supplies: +-2.5/+-3.3

The versatile power supply options allow for compatibility with different systems, offering flexibility in application.

No. of Terminals: 16

The ample number of terminals provides connectivity options for various components, enabling versatile integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offers adaptability to different mounting and heat dissipation requirements, ensuring optimal performance.

Maximum High Level Input Current: 0.0001 Amp

The low input current requirement helps in minimizing power consumption and improving energy efficiency.

Minimum Supply Voltage: 2.375 V

With a low minimum supply voltage, this product can operate effectively even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions, making it a robust choice.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in both extreme cold and hot conditions, increasing versatility.

Terminal Finish: TIN LEAD

The tin lead finish provides good conductivity and solderability, facilitating secure and stable connections.

Terminal Position: QUAD

The quad terminal position offers efficient layout options on a circuit board, enabling neat and organized assembly.

Maximum Seated Height: 1 mm

The low seated height allows for a compact component size, contributing to space-saving design considerations.

Width: 3 mm

The narrow width contributes to a compact footprint, making it suitable for applications where space is limited.

Differential Output: YES

The differential output helps in reducing common-mode noise and enhancing signal integrity, improving overall performance.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance ensures durability during soldering processes, preventing damage to the product.

Length: 3 mm

The short length contributes to a compact and space-efficient design, ideal for applications with size constraints.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is suitable for rugged and demanding environments, ensuring reliability in harsh conditions.

Maximum Receive Delay: 0.155 ns

The low receive delay helps in achieving fast data reception and processing, enhancing overall communication efficiency.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and maintenance, reducing complexity and potential points of failure.

Input Characteristics: DIFFERENTIAL

The differential input characteristics help in minimizing noise and interference, improving signal quality and reliability.

Nominal Supply Voltage: 2.5 V

The stable nominal supply voltage ensures consistent performance and reliability, making it a dependable choice for various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packing and efficient use of space on a circuit board, enhancing overall design flexibility.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type provides compatibility with various communication protocols, making it a versatile solution for different applications.

Technical Specifications

Line Drivers & Receivers NBSG16MMNR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.155 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.155 ns

Width:

3 mm

Trade Compliance

NBSG16MMNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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