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NBSG16MAHTBG

Onsemi

NBSG16MAHTBG by Onsemi

NBSG16MAHTBG by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.14 ns and differential output. Suitable for industrial applications requiring precise signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,931 parts In-Stock

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Vyrian

USA . 671 parts In-Stock

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671

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Problanco Electronics

Mexico . 6,267 parts In-Stock

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6,267

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SupplyDigital Components

Austria . 2,981 parts In-Stock

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Corphita

USA . 2,204 parts In-Stock

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TANS Electronics

Latvia . 1,263 parts In-Stock

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Kulean Microsystems

USA . 993 parts In-Stock

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UHIMA Technologies

Türkiye . 470 parts In-Stock

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470

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Corohmni

South Africa . 291 parts In-Stock

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Overview

Experience seamless data transmission with the NBSG16MAHTBG by Onsemi, a top-tier manufacturer known for its superior quality products. As a leading player in the Line Drivers & Receivers category, this device offers unmatched reliability and precision. Ideal for industrial applications, this compact yet powerful tool boasts a range of benefits including fast transmit and receive delays, differential output capabilities, and a wide operating temperature range. Trust Onsemi to deliver cutting-edge solutions that meet your needs with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.465 V

Provides a wide operating range and compatibility with various power sources.

Package Shape: SQUARE

Offers a compact design that fits well within electronic systems.

Maximum Transmit Delay: 0.14 ns

Ensures fast and efficient data transmission, making the product suitable for high-speed applications.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, THIN PROFILE

Enables a low-profile and space-saving design, ideal for compact electronic devices.

Minimum Supply Voltage: 2.375 V

Allows for operation at lower voltage levels, saving energy and increasing versatility.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Enables operation in harsh cold environments without compromising performance.

Terminal Position: BOTTOM

Facilitates easy and secure connection to the PCB, ensuring stable operation.

Maximum Seated Height: 1.03 mm

Offers a low profile design that contributes to space efficiency and ease of integration.

Width: 4 mm

Contributes to the compact size and overall sleek appearance of the product.

Differential Output: YES

Provides balanced and noise-resistant signal output, suitable for high-fidelity data transmission.

Length: 4 mm

Contributes to the square package shape, ensuring a uniform and symmetrical design.

Temperature Grade: INDUSTRIAL

Certified for industrial use, ensuring reliability and performance in demanding applications.

Maximum Receive Delay: 0.14 ns

Ensures fast response time for receiving incoming data, critical for real-time applications.

Terminal Form: BALL

Enables secure and reliable solder connections to the PCB, ensuring durability and stability.

Input Characteristics: DIFFERENTIAL

Provides noise immunity and signal integrity, ideal for long-distance communication and noisy environments.

Nominal Supply Voltage: 2.5 V

Optimal operating voltage for efficient performance and compatibility with standard power sources.

Terminal Pitch: 1 mm

Ensures accurate and reliable connections to the PCB, reducing the risk of signal interference or loss.

Interface IC Type: LINE TRANSCEIVER

Facilitates the conversion and transmission of signals between different communication protocols, enhancing compatibility and versatility.

Technical Specifications

Line Drivers & Receivers NBSG16MAHTBG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

.14 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.03 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

.14 ns

Width:

4 mm

Trade Compliance

NBSG16MAHTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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