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FIN1104MTC

Onsemi

FIN1104MTC by Onsemi

FIN1104MTC by Onsemi is a Line Transceiver with 4-bit driver and receiver functions. It operates at 3.3V supply voltage, has a max transmit delay of 1.75ns, and supports EIA-644-A interface standard. Ideal for industrial applications requiring differential input characteristics in a compact package style with dual terminal position.

Median Price

$2.420

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 135 parts In-Stock

1+ parts

$1.351

100+ parts

-

1k+ parts

-

10k+ parts

$0.619

135

$1.351

-

-

$0.619

Mouser Electronics

USA . 7,252 parts In-Stock

1+ parts

$1.980

100+ parts

$1.540

1k+ parts

-

10k+ parts

-

7,252

$1.980

$1.540

-

-

DigiKey

USA . 4,751 parts In-Stock

1+ parts

$2.860

100+ parts

$1.757

1k+ parts

$1.605

10k+ parts

$1.471

4,751

$2.860

$1.757

$1.605

$1.471

Chip1Stop

Japan . 83 parts In-Stock

1+ parts

$3.640

100+ parts

$2.160

1k+ parts

$1.700

10k+ parts

$1.450

83

$3.640

$2.160

$1.700

$1.450

Verical

USA . 70 parts In-Stock

1+ parts

-

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-

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70

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

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-

10

$1.570

-

-

-

Digiode

USA . 1,570 parts In-Stock

1+ parts

$2.632

100+ parts

-

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1,570

$2.632

-

-

-

Flip Electronics

USA . 3,050 parts In-Stock

1+ parts

-

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3,050

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Vyrian

USA . 2,817 parts In-Stock

1+ parts

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2,817

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Chip Stock

USA . 1,125 parts In-Stock

1+ parts

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1,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,964 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

10k+ parts

$1.538

4,964

$1.570

-

-

$1.538

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.570

-

-

-

Argo Parts USA

USA . 1,593 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

10k+ parts

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1,593

$1.570

-

-

-

Ampacity Inc.

Singapore . 2,690 parts In-Stock

1+ parts

$1.680

100+ parts

-

1k+ parts

-

10k+ parts

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2,690

$1.680

-

-

-

Corohmni

South Africa . 119 parts In-Stock

1+ parts

$1.974

100+ parts

-

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119

$1.974

-

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Corphita

USA . 2,662 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

-

10k+ parts

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2,662

$2.493

-

-

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Aztec Data Supply Inc.

USA . 3,634 parts In-Stock

1+ parts

$5.790

100+ parts

-

1k+ parts

-

10k+ parts

-

3,634

$5.790

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$9.759

100+ parts

$9.271

1k+ parts

$9.271

10k+ parts

-

5,000

$9.759

$9.271

$9.271

-

iodParts Technologies Inc.

India . 9,886 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,886

-

-

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Kulean Microsystems

USA . 8,056 parts In-Stock

1+ parts

-

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8,056

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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SupplyDigital Components

Austria . 4,688 parts In-Stock

1+ parts

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4,688

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Problanco Electronics

Mexico . 3,932 parts In-Stock

1+ parts

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3,932

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Glotronic Ltd.

UK . 3,900 parts In-Stock

1+ parts

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3,900

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TANS Electronics

Latvia . 3,145 parts In-Stock

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3,145

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 417 parts In-Stock

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417

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Supply Digital

USA . 349 parts In-Stock

1+ parts

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349

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Montclair Electronics, Inc.

USA . 5 parts In-Stock

1+ parts

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5

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Overview

Enhance your electronic designs with the top-quality FIN1104MTC by Onsemi, a leading manufacturer in the industry. This line driver and receiver offers unmatched performance and reliability for a wide range of applications. Its compact size and advanced features make it the ideal choice for demanding projects. Experience seamless communication and precise data transmission with the FIN1104MTC, providing exceptional value and benefits to all customers. Upgrade your systems today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, making it versatile and suitable for a variety of applications.

No. of Functions: 4

Offers multiple functions in one product, saving space and cost in the overall design.

Package Shape: RECTANGULAR

Standard shape that is easy to integrate into existing circuit designs.

Maximum Transmit Delay: 1.75 ns

Provides fast signal transmission, ideal for high-speed data communication.

Power Supplies (V): 3.3

Operates within a common voltage range, making it compatible with many systems.

No. of Terminals: 24

Offers a sufficient number of terminals for connecting to other components, ensuring flexibility in the setup.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design saves space on the circuit board, important for densely populated layouts.

Minimum Supply Voltage: 3 V

Can function reliably with lower voltage inputs, providing flexibility in power requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments with demanding conditions.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures without performance degradation, ideal for various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides strong connections and corrosion resistance for reliable performance over time.

Terminal Position: DUAL

Allows for easy connection to other components, enhancing compatibility and versatility.

Maximum Seated Height: 1.2 mm

Low profile design saves space and can be used in compact electronic devices.

Width: 4.4 mm

Narrow width enables placement in tight spaces on the circuit board, optimizing layout efficiency.

Receiver No. of Bits: 4

Provides precision in signal reception and transmission, ensuring accurate data transfer.

Differential Output: YES

Delivers clean and noise-free signals, reducing interference and improving signal quality.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during the reflow process, ensuring robust construction.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperatures during soldering, ensuring reliable connections.

Length: 7.8 mm

Compact length saves space on the circuit board, enabling efficient design layouts.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous requirements of industrial environments, ensuring reliability under harsh conditions.

Maximum Receive Delay: 1.75 ns

Ensures fast and accurate data reception, critical for real-time applications and high-speed communication.

Terminal Form: GULL WING

Easy to solder and provides secure connections, enhancing the overall reliability of the product.

Interface Standard: EIA-644-A; TIA-644-A

Complies with industry standards for interface communication, ensuring compatibility with other devices.

Input Characteristics: DIFFERENTIAL

Differential inputs provide noise immunity and better signal quality, enhancing performance in noisy environments.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance, critical for reliable operation.

Terminal Pitch: 0.65 mm

Fine pitch terminals enable high-density mounting on the circuit board, maximizing space efficiency.

Driver No. of Bits: 4

Provides accurate signal transmission, ensuring data integrity in communication systems.

Interface IC Type: LINE TRANSCEIVER

Designed specifically for signal transmission over long distances, making it suitable for various communication applications.

Technical Specifications

Line Drivers & Receivers FIN1104MTC attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

1.75 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

1.75 ns

Width:

4.4 mm

Trade Compliance

FIN1104MTC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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