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NB6L239MNR2G

Onsemi

NB6L239MNR2G by Onsemi

NB6L239MNR2G clock driver by Onsemi features a propagation delay of 0.57 ns, operates at a supply voltage of 2.5/3.3 V, and has a terminal pitch of 0.5 mm. Ideal for industrial applications requiring differential input conditioning and ECL technology, this chip carrier package with a very thin profile is designed for high-speed operations up to 3000 MHz.

Median Price

$14.400

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 181 parts In-Stock

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$14.400

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$13.291

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$12.738

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Vyrian

USA . 11,217 parts In-Stock

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Chip Stock

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Digiode

USA . 873 parts In-Stock

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Sensible Micro Corp

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475

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Distributors (Availability)

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AZTECH Wire

Italy . 173 parts In-Stock

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$11.120

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TANS Electronics

Latvia . 6,025 parts In-Stock

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Kulean Microsystems

USA . 5,966 parts In-Stock

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Problanco Electronics

Mexico . 5,645 parts In-Stock

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SupplyDigital Components

Austria . 3,673 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

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Corohmni

South Africa . 364 parts In-Stock

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Microchip USA

USA . 256 parts In-Stock

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UHIMA Technologies

Türkiye . 252 parts In-Stock

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Overview

Enhance your electronic designs with the NB6L239MNR2G clock driver and buffer from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. Ideal for applications requiring high-speed clock distribution, this chip carrier features a very thin profile and differential input conditioning for seamless integration. With a fast propagation delay of just 0.6 ns, this clock driver offers unmatched performance and precision. Elevate your projects with the superior value and benefits that the NB6L239MNR2G brings to the table.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.6 ns

Low propagation delay ensures efficient and fast performance.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides noise immunity and reliable signal processing.

Nominal Supply Voltage: 2.5 V

Stable supply voltage of 2.5V ensures consistent and reliable operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C makes it suitable for industrial environments.

Technical Specifications

Clock Drivers & Buffers NB6L239MNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.57 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

3000 MHz

Trade Compliance

NB6L239MNR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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