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NB6L16DTR2G

Onsemi

NB6L16DTR2G by Onsemi

NB6L16DTR2G clock driver by Onsemi is a differential input conditioning device with 0.18 ns propagation delay. Operating in industrial temperature range (-40 to 85 °C), it has 8 terminals, small outline package style, and supports a supply voltage range of 2.375V to 3.465V. Ideal for applications requiring precise clock signal distribution in electronic systems.

Median Price

$6.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,186 parts In-Stock

1+ parts

-

100+ parts

$6.490

1k+ parts

$5.810

10k+ parts

$5.460

1,186

-

$6.490

$5.810

$5.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 65 parts In-Stock

1+ parts

$6.859

100+ parts

-

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65

$6.859

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Vyrian

USA . 4,755 parts In-Stock

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4,755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 66 parts In-Stock

1+ parts

$6.060

100+ parts

-

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66

$6.060

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-

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Corphita

USA . 711 parts In-Stock

1+ parts

$6.498

100+ parts

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711

$6.498

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Component Stockers USA

USA . 6,109 parts In-Stock

1+ parts

$7.370

100+ parts

$6.930

1k+ parts

$6.260

10k+ parts

-

6,109

$7.370

$6.930

$6.260

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AZTECH Wire

Italy . 265 parts In-Stock

1+ parts

$9.360

100+ parts

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265

$9.360

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QUARKTWIN TECHNOLOGY LTD

USA . 20,919 parts In-Stock

1+ parts

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20,919

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TANS Electronics

Latvia . 5,026 parts In-Stock

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5,026

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Kulean Microsystems

USA . 4,242 parts In-Stock

1+ parts

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4,242

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Microchip USA

USA . 2,596 parts In-Stock

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2,596

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SupplyDigital Components

Austria . 1,659 parts In-Stock

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1,659

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Problanco Electronics

Mexico . 1,215 parts In-Stock

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1,215

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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324

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Overview

Unlock the potential of your electronic devices with the NB6L16DTR2G clock driver & buffer by Onsemi. Designed with precision and quality in mind, this product offers reliable performance and compatibility for a wide range of applications. Whether you're looking to enhance the speed and efficiency of your circuit design or improve signal integrity, this clock driver & buffer delivers unparalleled value and benefits. Trust Onsemi's reputation for innovation and excellence, and experience the advantages of seamless integration and optimal performance in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and durability for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL

Enables reliable and accurate signal processing, reducing noise and interference in data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Operates efficiently at a standard voltage level, making it compatible with a wide range of systems.

Propagation Delay (tpd): 0.18 ns

Provides fast signal propagation, ensuring precise timing and synchronization in clock distribution.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range from -40 °C to 85°C.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power clock signal generation.

Technical Specifications

Clock Drivers & Buffers NB6L16DTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L16DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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