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NB100LVEP224FAR2

Onsemi

NB100LVEP224FAR2 by Onsemi

NB100LVEP224FAR2 Clock Driver by Onsemi features 24 true outputs, 0.75 ns propagation delay, and ECL technology. Ideal for applications requiring differential mux input conditioning in a compact 64-terminal flatpack package with low profile design. Operating temperature range from 0 to 85 °C makes it suitable for various electronic systems.

Median Price

$22.444

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$19.950

1k+ parts

$17.850

10k+ parts

$16.800

200

-

$19.950

$17.850

$16.800

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$24.938

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-

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200

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$24.938

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Distributors (In-Stock)

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Digiode

USA . 1,001 parts In-Stock

1+ parts

$21.109

100+ parts

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1,001

$21.109

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Vyrian

USA . 4,018 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 119 parts In-Stock

1+ parts

$9.370

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119

$9.370

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Corphita

USA . 1,527 parts In-Stock

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$19.998

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1,527

$19.998

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Corohmni

South Africa . 182 parts In-Stock

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$20.080

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182

$20.080

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Problanco Electronics

Mexico . 7,367 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,503 parts In-Stock

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6,503

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,627 parts In-Stock

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TANS Electronics

Latvia . 1,153 parts In-Stock

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UHIMA Technologies

Türkiye . 830 parts In-Stock

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Microchip USA

USA . 287 parts In-Stock

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Continental Prestige Electronics

USA . 200 parts In-Stock

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$18.920

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$18.920

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Kulean Microsystems

USA . 101 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the NB100LVEP224FAR2 clock driver from Onsemi. As a trusted leader in the industry, Onsemi delivers top-quality products that exceed expectations. The clock drivers & buffers category offers unmatched performance for various applications, ensuring seamless operation and efficiency. Elevate your systems with the NB100LVEP224FAR2 and enjoy the value of superior technology, enhanced functionality, and optimal results. Choose Onsemi for cutting-edge solutions that make a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Surface Mount: YES

Easy installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 2.5

Stable and efficient power supply for the clock driver, ensuring consistent performance.

Propagation Delay (tpd): 0.75 ns

Fast signal propagation within the clock driver, allowing for precise timing and synchronization in your circuit.

Maximum Operating Temperature: 85 °C

Can operate effectively in a wide range of temperature conditions, making it suitable for various environments.

Technical Specifications

Clock Drivers & Buffers NB100LVEP224FAR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

10 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

.75 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.04 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP224FAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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