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NB100LVEP222FAR2G

Onsemi

NB100LVEP222FAR2G by Onsemi

NB100LVEP222FAR2G Clock Driver by Onsemi features 1ns Propagation Delay, 52 Terminals, and ECL Technology. Ideal for industrial applications requiring a differential mux with low profile flatpack packaging and quad terminal position. Operating temperature range from -40 to 85 °C makes it suitable for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 786 parts In-Stock

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Vyrian

USA . 53 parts In-Stock

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Problanco Electronics

Mexico . 7,184 parts In-Stock

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SupplyDigital Components

Austria . 5,898 parts In-Stock

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TANS Electronics

Latvia . 4,572 parts In-Stock

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Kulean Microsystems

USA . 3,093 parts In-Stock

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Corphita

USA . 1,272 parts In-Stock

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UHIMA Technologies

Türkiye . 567 parts In-Stock

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Corohmni

South Africa . 264 parts In-Stock

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Overview

Enhance the performance of your clock systems with the NB100LVEP222FAR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Clock Drivers & Buffers that provide reliable differential mux input conditioning for various applications. The NB100LVEP222FAR2G offers exceptional value with its low profile package style and quick 1 ns propagation delay, ensuring efficient operation in industrial settings. Trust Onsemi to deliver cutting-edge technology that meets your needs for precision timing and synchronization. Elevate your clock system performance today with the NB100LVEP222FAR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Facilitates easier and more efficient assembly onto circuit boards, making the product suitable for mass production.

Input Conditioning: DIFFERENTIAL MUX

Allows for efficient and accurate signal processing, ensuring reliable performance in data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for the product, ensuring stable operation without the risk of overloading or underperformance.

No. of Terminals: 52

Offers a high level of connectivity for various input and output options, allowing for versatile usage in different electronic systems.

Propagation Delay (tpd): 1 ns

Provides fast response times for signal propagation, making the product suitable for applications requiring quick data processing.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring the product remains operational in challenging conditions.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments, making it suitable for a wide range of industrial applications.

Width: 10 mm

Compact form factor allows for easy integration into tight spaces, making it ideal for applications with limited physical footprint.

Technology: ECL

Utilizes Emitter-Coupled Logic technology, known for high-speed operation and low power consumption, making the product energy-efficient and reliable.

Technical Specifications

Clock Drivers & Buffers NB100LVEP222FAR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

NB100LVEP222FAR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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