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NB100LVEP221FAG

Onsemi

NB100LVEP221FAG by Onsemi

NB100LVEP221FAG clock driver by Onsemi features a propagation delay of 0.71ns, operates in industrial temperature range (-40 to 85 °C), and has 52 terminals in a flatpack package. It is used for differential mux input conditioning applications requiring ECL technology with a supply voltage range of 2.375V to 3.8V.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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AZTECH Wire

Italy . 871 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,080 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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Corphita

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TANS Electronics

Latvia . 1,985 parts In-Stock

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Corohmni

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Microchip USA

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UHIMA Technologies

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Overview

Enhance your clock driver and buffer applications with the NB100LVEP221FAG by Onsemi. With a reputation for top-quality products, Onsemi brings you a reliable solution that offers exceptional value and benefits to customers. This product boasts a wide range of advantages, from its differential MUX input conditioning to its fast propagation delay of just 0.71 ns. Perfect for industrial-grade environments, this clock driver will optimize your system's performance with its 52 terminals and low profile design. Upgrade your setup today with the NB100LVEP221FAG and experience seamless operation like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan of the product.

Surface Mount: YES

Allows for easy installation and compatibility with modern PCB designs, making it convenient for manufacturers.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard voltage, making it compatible with various electronic systems and power sources.

Propagation Delay (tpd): 0.71 ns

Offers fast signal transmission speeds, ensuring efficient performance in time-sensitive applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments and harsh conditions.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, ensuring reliability in different environmental conditions.

Technical Specifications

Clock Drivers & Buffers NB100LVEP221FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

.71 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP221FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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