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NB100LVEP222FARG

Onsemi

NB100LVEP222FARG by Onsemi

NB100LVEP222FARG clock driver by Onsemi features a propagation delay of 1.2 ns, operates at a nominal voltage of 2.5V, and offers differential mux input conditioning. This ECL technology device is suitable for industrial applications requiring precise timing synchronization in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 3,720 parts In-Stock

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Vyrian

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Digiode

USA . 1,199 parts In-Stock

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AZTECH Wire

Italy . 824 parts In-Stock

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$18.350

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Component Stockers USA

USA . 588 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 15,645 parts In-Stock

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Kulean Microsystems

USA . 7,266 parts In-Stock

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Problanco Electronics

Mexico . 6,645 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,539 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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TANS Electronics

Latvia . 2,319 parts In-Stock

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SupplyDigital Components

Austria . 2,274 parts In-Stock

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Corphita

USA . 1,949 parts In-Stock

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Metaverse IC Inc.

Canada . 750 parts In-Stock

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UHIMA Technologies

Türkiye . 473 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 79 parts In-Stock

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Kepictronics

USA . 58 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB100LVEP222FARG clock driver and buffer by Onsemi. Designed with precision and reliability in mind, this product offers fast propagation delay and a wide range of power supplies for optimal functionality. Perfect for a variety of applications, from telecommunications to industrial automation, this square-shaped clock driver ensures smooth operation and seamless data transmission. Trust Onsemi's expertise in clock drivers & buffers, and experience the superior quality and efficiency that the NB100LVEP222FARG brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Propagation Delay At Nominal Supply: 1.2 ns

The low propagation delay ensures quick signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning helps improve signal integrity and reduce noise in the system, ensuring reliable performance.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage makes this product compatible with a wide range of electronic devices and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product is suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that this product can operate effectively in cold environments without any issues.

No. of True Outputs: 4

Having 4 true outputs provides flexibility in signal routing and processing, making this product versatile for various applications.

Technical Specifications

Clock Drivers & Buffers NB100LVEP222FARG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

1.2 ns

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP222FARG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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