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NB100LVEP221FARG

Onsemi

NB100LVEP221FARG by Onsemi

NB100LVEP221FARG clock driver by Onsemi features a propagation delay of 0.71 ns, operates at a supply voltage range of -2.5/-3.3/2.5/3.3 V, and offers 20 true outputs for differential mux input conditioning applications in industrial settings. This ECL technology device is surface mountable with a low profile square package style suitable for high-speed signal transmission requirements.

Median Price

$9.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 837 parts In-Stock

1+ parts

-

100+ parts

$9.600

1k+ parts

$8.590

10k+ parts

$8.090

837

-

$9.600

$8.590

$8.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,612 parts In-Stock

1+ parts

$10.156

100+ parts

-

1k+ parts

-

10k+ parts

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1,612

$10.156

-

-

-

Vyrian

USA . 4,386 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

-

4,386

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 967 parts In-Stock

1+ parts

$9.621

100+ parts

-

1k+ parts

-

10k+ parts

-

967

$9.621

-

-

-

Corohmni

South Africa . 56 parts In-Stock

1+ parts

$10.690

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$10.690

-

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AZTECH Wire

Italy . 903 parts In-Stock

1+ parts

$17.980

100+ parts

-

1k+ parts

-

10k+ parts

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903

$17.980

-

-

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Component Stockers USA

USA . 337 parts In-Stock

1+ parts

$99.990

100+ parts

-

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337

$99.990

-

-

-

A-Z Elektronik GmbH

Germany . 6,326 parts In-Stock

1+ parts

-

100+ parts

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6,326

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Kulean Microsystems

USA . 4,511 parts In-Stock

1+ parts

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4,511

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-

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TANS Electronics

Latvia . 3,690 parts In-Stock

1+ parts

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100+ parts

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3,690

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-

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Problanco Electronics

Mexico . 2,504 parts In-Stock

1+ parts

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2,504

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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SupplyDigital Components

Austria . 2,429 parts In-Stock

1+ parts

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2,429

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Microchip USA

USA . 250 parts In-Stock

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250

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UHIMA Technologies

Türkiye . 54 parts In-Stock

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54

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Overview

Enhance your clock driver and buffer applications with the NB100LVEP221FARG by Onsemi. Crafted with precision and expertise, Onsemi delivers unparalleled quality and reliability in every product. This clock driver boasts a fast propagation delay of just 0.8ns, ensuring efficient performance. With its differential mux input conditioning and wide voltage range, this device offers versatility and seamless integration into various systems. Trust Onsemi to provide innovative solutions that elevate your projects to new heights. Experience the difference with the NB100LVEP221FARG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.8 ns

With a fast propagation delay, this clock driver ensures quick and efficient signal transmission within the circuit.

Surface Mount: YES

Being surface mountable makes installation easy and saves space on the PCB, ideal for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, making it compatible with many electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without compromising performance, suitable for industrial applications.

Technical Specifications

Clock Drivers & Buffers NB100LVEP221FARG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.8 ns

Propagation Delay (tpd):

.71 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP221FARG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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