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NB100EP223FA

Onsemi

NB100EP223FA by Onsemi

NB100EP223FA clock driver by Onsemi features a propagation delay of 1.35 ns, differential mux input conditioning, and operates at a nominal voltage of 3.3V. It is ideal for applications requiring precise timing synchronization in electronic systems.

Median Price

$23.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 145 parts In-Stock

1+ parts

-

100+ parts

$19.990

1k+ parts

$17.880

10k+ parts

$16.830

145

-

$19.990

$17.880

$16.830

DigiKey

USA . 145 parts In-Stock

1+ parts

-

100+ parts

$23.150

1k+ parts

-

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145

-

$23.150

-

-

Verical

USA . 145 parts In-Stock

1+ parts

-

100+ parts

$24.988

1k+ parts

$22.350

10k+ parts

$21.038

145

-

$24.988

$22.350

$21.038

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,091 parts In-Stock

1+ parts

$21.147

100+ parts

-

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1,091

$21.147

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Vyrian

USA . 2,129 parts In-Stock

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2,129

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Distributors (Availability)

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Corphita

USA . 1,538 parts In-Stock

1+ parts

$20.034

100+ parts

-

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1,538

$20.034

-

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Corohmni

South Africa . 70 parts In-Stock

1+ parts

$22.260

100+ parts

-

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70

$22.260

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-

-

Component Stockers USA

USA . 157 parts In-Stock

1+ parts

$22.660

100+ parts

$21.300

1k+ parts

-

10k+ parts

-

157

$22.660

$21.300

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-

Advanced Electronics

New Zealand . 99 parts In-Stock

1+ parts

$38.520

100+ parts

$35.053

1k+ parts

$31.586

10k+ parts

-

99

$38.520

$35.053

$31.586

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A-Z Elektronik GmbH

Germany . 6,446 parts In-Stock

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6,446

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Problanco Electronics

Mexico . 6,378 parts In-Stock

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6,378

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SupplyDigital Components

Austria . 5,321 parts In-Stock

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TANS Electronics

Latvia . 4,953 parts In-Stock

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4,953

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Kulean Microsystems

USA . 3,550 parts In-Stock

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3,550

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UHIMA Technologies

Türkiye . 725 parts In-Stock

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725

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Kepictronics

USA . 317 parts In-Stock

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317

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Microchip USA

USA . 295 parts In-Stock

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295

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Continental Prestige Electronics

USA . 145 parts In-Stock

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145

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Overview

Elevate your electronic designs with the NB100EP223FA clock driver by Onsemi. This high-quality product not only showcases the expertise of its manufacturer but also offers unparalleled value to customers. Perfect for a wide range of applications in clock drivers & buffers, this innovative component provides fast propagation delay and low power consumption. Say goodbye to delays and hello to efficiency with the NB100EP223FA – the ultimate solution for all your timing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components and ensures durability of the product.

Propagation Delay At Nominal Supply: 1.35 ns

With a fast propagation delay, this clock driver and buffer ensures accurate and efficient signal transmission.

Surface Mount: YES

Surface mount capability makes installation and PCB layout easier, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning helps in minimizing noise and signal distortion, improving overall signal quality.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard nominal supply voltage level, ensuring compatibility with a wide range of systems.

Power Supplies (V): 1.8,3.3

Supports multiple power supply voltages, offering flexibility in different system configurations.

No. of Terminals: 64

Having a high number of terminals allows for connectivity to various external components and devices.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without any performance issues, making it suitable for diverse applications.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption, ideal for applications requiring fast and efficient processing.

Technical Specifications

Clock Drivers & Buffers NB100EP223FA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8,3.3

Propagation Delay At Nominal Supply:

1.35 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.065 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100EP223FA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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