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NB100EP223FAG

Onsemi

NB100EP223FAG by Onsemi

NB100EP223FAG clock driver by Onsemi features a propagation delay of 1.35 ns, operates at a nominal voltage of 3.3V, and offers differential mux input conditioning. This device is suitable for applications requiring precise timing synchronization in electronic systems.

Median Price

$15.289

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,130 parts In-Stock

1+ parts

-

100+ parts

$13.590

1k+ parts

$12.160

10k+ parts

$11.440

1,130

-

$13.590

$12.160

$11.440

Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$16.988

1k+ parts

$15.200

10k+ parts

$14.300

600

-

$16.988

$15.200

$14.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 203 parts In-Stock

1+ parts

$14.383

100+ parts

-

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203

$14.383

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Vyrian

USA . 7,579 parts In-Stock

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7,579

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 71 parts In-Stock

1+ parts

$12.490

100+ parts

-

1k+ parts

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71

$12.490

-

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Corphita

USA . 223 parts In-Stock

1+ parts

$13.626

100+ parts

-

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223

$13.626

-

-

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Corohmni

South Africa . 357 parts In-Stock

1+ parts

$13.680

100+ parts

-

1k+ parts

-

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357

$13.680

-

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SupplyDigital Components

Austria . 6,400 parts In-Stock

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6,400

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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TANS Electronics

Latvia . 3,602 parts In-Stock

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3,602

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Kulean Microsystems

USA . 3,602 parts In-Stock

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3,602

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Continental Prestige Electronics

USA . 1,130 parts In-Stock

1+ parts

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100+ parts

$12.890

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1,130

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$12.890

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Problanco Electronics

Mexico . 721 parts In-Stock

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721

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Microchip USA

USA . 349 parts In-Stock

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349

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UHIMA Technologies

Türkiye . 221 parts In-Stock

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Kepictronics

USA . 60 parts In-Stock

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60

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Overview

Enhance your clock signal performance with the NB100EP223FAG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. Clock Drivers & Buffers like this one offer precise synchronization and signal conditioning, making them ideal for high-speed data communication applications. With a low propagation delay and differential mux input conditioning, this product ensures optimal signal integrity. Upgrade your system with the NB100EP223FAG and experience seamless operation and improved efficiency. Choose Onsemi for superior products that deliver unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 1.35 ns

Low propagation delay enables timely signal processing, ensuring efficient operation of the clock driver and buffers.

Surface Mount: YES

Surface mount capability makes installation and assembly of the product convenient and space-efficient, suitable for modern electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 64

Having a high number of terminals allows for versatile connectivity options, accommodating complex circuit configurations and signal routing needs.

Propagation Delay (tpd): 1.2 ns

With a minimal propagation delay of 1.2 ns, the product offers fast signal transmission and synchronization, critical for precision timing applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even under demanding thermal conditions, making it suitable for industrial and automotive applications.

Technology: ECL

Utilizing Emitter-Coupled Logic technology provides high-speed operation and low power consumption, making the product efficient and suitable for high-performance applications.

Technical Specifications

Clock Drivers & Buffers NB100EP223FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Propagation Delay At Nominal Supply:

1.35 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.065 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100EP223FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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