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NB100EP223FAR2G

Onsemi

NB100EP223FAR2G by Onsemi

NB100EP223FAR2G clock driver by Onsemi features a propagation delay of 1.35 ns, operates at a nominal voltage of 3.3V, and offers differential mux input conditioning. This ECL technology component with 64 terminals is suitable for applications requiring precise timing synchronization in electronic systems.

Median Price

$15.289

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$13.590

1k+ parts

$12.160

10k+ parts

$11.440

130

-

$13.590

$12.160

$11.440

Verical

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$16.988

1k+ parts

$15.200

10k+ parts

$14.300

130

-

$16.988

$15.200

$14.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 728 parts In-Stock

1+ parts

$14.383

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-

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728

$14.383

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Vyrian

USA . 4,302 parts In-Stock

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4,302

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Distributors (Availability)

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AZTECH Wire

Italy . 932 parts In-Stock

1+ parts

$9.990

100+ parts

-

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932

$9.990

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Corphita

USA . 677 parts In-Stock

1+ parts

$13.626

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-

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677

$13.626

-

-

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Corohmni

South Africa . 303 parts In-Stock

1+ parts

$13.680

100+ parts

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303

$13.680

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Component Stockers USA

USA . 179 parts In-Stock

1+ parts

$15.350

100+ parts

$14.430

1k+ parts

-

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179

$15.350

$14.430

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Problanco Electronics

Mexico . 7,063 parts In-Stock

1+ parts

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7,063

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SupplyDigital Components

Austria . 6,584 parts In-Stock

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6,584

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Kulean Microsystems

USA . 3,953 parts In-Stock

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TANS Electronics

Latvia . 2,939 parts In-Stock

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UHIMA Technologies

Türkiye . 405 parts In-Stock

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Microchip USA

USA . 190 parts In-Stock

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Continental Prestige Electronics

USA . 130 parts In-Stock

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$12.890

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130

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$12.890

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Overview

Unlock unparalleled performance and precision with the NB100EP223FAR2G by Onsemi. Crafted with cutting-edge technology, this clock driver & buffer ensures seamless synchronization in your applications. With a fast propagation delay of 1.35 ns and differential mux input conditioning, this product guarantees optimal functionality. Experience the reliability and efficiency that only Onsemi can deliver, providing you with the competitive edge you need. Trust in the quality of Onsemi and elevate your projects to new heights with the NB100EP223FAR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the clock driver & buffer.

Propagation Delay At Nominal Supply: 1.35 ns

Low propagation delay ensures efficient and quick signal transmission within the circuit.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL MUX

Utilizing a differential multiplexer enhances signal integrity and reduces noise interference in the circuit.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level of 3.3V, making it compatible with many electronic systems.

Power Supplies (V): 1.8,3.3

Offers flexibility in power supply options for different system requirements.

No. of Terminals: 64

Sufficient number of terminals for connecting to various components and peripherals in a circuit.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Provides different package styles to cater to different design and space constraints.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: 0 °C

Can also operate at low temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN

Tin finish ensures good conductivity and solderability for reliable connections.

Width: 10 mm

Compact width allows for efficient use of space on the circuit board.

Length: 10 mm

Compact length contributes to the overall space-saving design of the clock driver & buffer.

Technology: ECL

Utilizing Emitter-Coupled Logic technology provides high-speed performance and low power consumption.

No. of True Outputs: 22

Multiple true outputs allow for driving multiple devices simultaneously, increasing the versatility of the product.

Technical Specifications

Clock Drivers & Buffers NB100EP223FAR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Propagation Delay At Nominal Supply:

1.35 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.065 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100EP223FAR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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