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NB100LVEP222MNG

Onsemi

NB100LVEP222MNG by Onsemi

NB100LVEP222MNG Clock Driver by Onsemi features 52 terminals, 1ns propagation delay, and operates at -40 to 85 °C. It is used for differential mux input conditioning in industrial applications.

Median Price

$18.184

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 180 parts In-Stock

1+ parts

$22.720

100+ parts

$15.837

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$14.873

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180

$22.720

$15.837

$14.873

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Verical

USA . 62 parts In-Stock

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$13.648

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62

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$13.648

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Digiode

USA . 339 parts In-Stock

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$20.092

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339

$20.092

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Vyrian

USA . 3,686 parts In-Stock

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Flip Electronics

USA . 780 parts In-Stock

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780

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Distributors (Availability)

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Corphita

USA . 406 parts In-Stock

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$19.035

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406

$19.035

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Corohmni

South Africa . 174 parts In-Stock

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$21.150

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Microchip USA

USA . 2,176 parts In-Stock

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$51.060

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$51.060

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Problanco Electronics

Mexico . 4,759 parts In-Stock

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4,759

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 3,178 parts In-Stock

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RC Electronics

USA . 2,649 parts In-Stock

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TANS Electronics

Latvia . 2,564 parts In-Stock

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iodParts Technologies Inc.

India . 2,510 parts In-Stock

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Kulean Microsystems

USA . 975 parts In-Stock

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975

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Perfect Parts

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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576

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Overview

Unlock seamless clock distribution with the NB100LVEP222MNG by Onsemi. As a leader in clock drivers & buffers, Onsemi delivers unmatched quality and reliability. Ideal for applications requiring differential mux input conditioning, this surface mount chip carrier boasts a nominal supply voltage of 2.5V and a maximum operating temperature of 85 °C, making it perfect for industrial use. With a propagation delay of just 1ns, this product ensures precision timing control. Experience the value of efficient clock management with the NB100LVEP222MNG by Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology offers space-saving design and allows for automated assembly, making the product suitable for compact electronic devices.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning ensures reliable and accurate signal processing, making this product ideal for applications requiring precise timing.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V makes this product energy-efficient and suitable for battery-powered devices.

Propagation Delay (tpd): 1 ns

With a fast propagation delay of 1 ns, this clock driver can provide quick and efficient signal processing, making it suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

With a wide minimum operating temperature range of -40 °C, this product can function reliably in various environmental conditions.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85 °C, this clock driver ensures reliability and stability even in elevated temperature environments.

Technology: ECL

Utilizing ECL technology, this product offers high-speed performance and low power consumption, making it suitable for demanding electronic applications.

Technical Specifications

Clock Drivers & Buffers NB100LVEP222MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Maximum Power Supply Current (ICC):

168 mA

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB100LVEP222MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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