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NB100LVEP222FA

Onsemi

NB100LVEP222FA by Onsemi

NB100LVEP222FA Clock Driver by Onsemi features 1ns Propagation Delay, -40 to 85 °C Operating Temp, and ECL Technology. Ideal for clock distribution in industrial settings with a supply voltage range of 2.375V to 3.8V. This differential mux driver comes in a square package with 52 terminals for surface mount applications.

Median Price

$31.036

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$31.036

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10

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Chip Stock

USA . 3,700 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 2,985 parts In-Stock

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Vyrian

USA . 1,589 parts In-Stock

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Digiode

USA . 1,258 parts In-Stock

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Prism Electronics

USA . 108 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$9.736

100+ parts

$8.860

1k+ parts

$7.984

10k+ parts

-

150

$9.736

$8.860

$7.984

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Component Stockers USA

USA . 206 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 6,567 parts In-Stock

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RC Electronics

USA . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 5,229 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 2,080 parts In-Stock

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SupplyDigital Components

Austria . 2,041 parts In-Stock

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Kulean Microsystems

USA . 1,469 parts In-Stock

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Corphita

USA . 1,380 parts In-Stock

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UHIMA Technologies

Türkiye . 601 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 97 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB100LVEP222FA clock driver from Onsemi. With a commitment to quality and innovation, Onsemi is a trusted manufacturer in the industry. Ideal for clock distribution applications, this product offers precise and reliable signal conditioning, ensuring smooth operation. Experience improved efficiency and accuracy in your designs with the NB100LVEP222FA, providing value and benefits that exceed expectations. Elevate your projects with this top-of-the-line clock driver today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures the product is resistant to damage and provides long-term reliability.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Input Conditioning: DIFFERENTIAL MUX

Allows for versatile input options and signal processing capabilities.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for stable performance and efficient power consumption.

Propagation Delay (tpd): 1 ns

Fast signal propagation ensures minimal delay in clock distribution.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for various industrial environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme temperature conditions without compromising functionality.

Technology: ECL

High-speed ECL technology for reliable and efficient clock distribution.

Technical Specifications

Clock Drivers & Buffers NB100LVEP222FA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e0

Length:

10 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP222FA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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