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NB100LVEP221FAR2

Onsemi

NB100LVEP221FAR2 by Onsemi

NB100LVEP221FAR2 Clock Driver by Onsemi features a Propagation Delay of 0.71ns, 52 Terminals, and operates at Industrial Temperature Grade. It is used for clock distribution in high-speed applications requiring low skew and supports differential mux input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,226 parts In-Stock

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Digiode

USA . 2,345 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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AZTECH Wire

Italy . 328 parts In-Stock

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$19.420

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QUARKTWIN TECHNOLOGY LTD

USA . 20,604 parts In-Stock

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SupplyDigital Components

Austria . 8,299 parts In-Stock

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Kulean Microsystems

USA . 7,885 parts In-Stock

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Microchip USA

USA . 4,226 parts In-Stock

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Problanco Electronics

Mexico . 1,724 parts In-Stock

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TANS Electronics

Latvia . 484 parts In-Stock

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UHIMA Technologies

Türkiye . 337 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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Corphita

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Overview

Enhance your clock driver and buffer needs with the NB100LVEP221FAR2 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. Clock Drivers & Buffers play a crucial role in various applications such as networking, telecommunications, and data centers. With the NB100LVEP221FAR2, customers can expect unparalleled performance, efficiency, and seamless integration into their systems. Trust Onsemi to deliver exceptional value and benefits that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material which can protect the internal components of the clock driver & buffer, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Propagation Delay (tpd): 0.71 ns

Provides fast signal transmission and minimal delay, making this clock driver & buffer suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 2.5

Compatible with a common supply voltage, ensuring compatibility with various systems and devices.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with a wide operating temperature range, ensuring reliable performance in challenging conditions.

Technical Specifications

Clock Drivers & Buffers NB100LVEP221FAR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e0

Length:

10 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

.71 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP221FAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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