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NB100LVEP222FAR2

Onsemi

NB100LVEP222FAR2 by Onsemi

NB100LVEP222FAR2 Clock Driver by Onsemi operates at 2.5V with a propagation delay of 1ns. It features 52 terminals in a square package, suitable for industrial applications requiring differential mux input conditioning and quad terminal position.

Median Price

$15.590

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 28 parts In-Stock

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$15.590

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28

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Vyrian

USA . 3,004 parts In-Stock

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3,004

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Digiode

USA . 1,491 parts In-Stock

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1,491

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Distributors (Availability)

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AZTECH Wire

Italy . 962 parts In-Stock

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$11.020

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962

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Advanced Electronics

New Zealand . 34 parts In-Stock

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$26.664

100+ parts

$24.264

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$21.864

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34

$26.664

$24.264

$21.864

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Problanco Electronics

Mexico . 7,689 parts In-Stock

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7,689

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SupplyDigital Components

Austria . 7,609 parts In-Stock

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7,609

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TANS Electronics

Latvia . 3,934 parts In-Stock

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Kulean Microsystems

USA . 2,633 parts In-Stock

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2,633

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UHIMA Technologies

Türkiye . 630 parts In-Stock

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630

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Corphita

USA . 306 parts In-Stock

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Microchip USA

USA . 267 parts In-Stock

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Corohmni

South Africa . 111 parts In-Stock

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Overview

Enhance your clock driver and buffer needs with the NB100LVEP222FAR2 by Onsemi. Crafted with precision and quality, Onsemi's reputation precedes itself in delivering top-notch components. Clock Drivers & Buffers have never been more efficient, versatile, and easy to use. With a wide range of applications, this product caters to various industries, providing unmatched value and benefits to customers. Elevate your projects with the NB100LVEP222FAR2 and experience seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into circuit boards, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential MUX input conditioning allows for accurate signal processing and reduces noise interference, improving overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage ensures compatibility with a wide range of systems and devices.

Propagation Delay (tpd): 1 ns

With a low propagation delay of 1 ns, this product ensures fast and efficient signal transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the product can operate in extreme cold conditions.

Technology: ECL

The ECL technology used in this product offers high-speed performance and low power consumption, making it suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers NB100LVEP222FAR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e0

Length:

10 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.7 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP222FAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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